
Parameter | Value |
---|---|
Termination | Solder |
Max Operating Temperature | 85 °C |
Min Operating Temperature | -25 °C |
Packaging | Box |
RoHS | Compliant |
Contact Plating | Gold over Nickel |
Contact Material(Contact Finish) | Copper Alloy |
Pitch | 600 µm |
Gender | Female |
Contact Type | |
Number of Positions | 200 |
Number of Rows | 2 |
Card Thickness | 1 mm |
Housing Material | Resin |
Mounting Angle | Vertical |
Card Type | DDR2 |
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