PCB Capability
Feature | Capability | illustration |
---|---|---|
Layers | 1-8 layers | |
Material | FR-4 | |
Board Thickness | 0.016"- 0.1"(0.4mm-2.5mm) | |
Outer Thickness | 1.0oz-2.0oz | |
Inner Copper Thickness | 0.5oz 1.0oz,2.0oz | |
Max Board Size | 500x600mm | |
Min Tracing/Spacing | 0.1mm(4mil) | |
Minimum Annular Ring | 0.125mm(5mil) | |
Min Drilling Hole Diameter | 0.2mm(8mil) | |
Min Width of Cutout (NPTH) | 0.8mm | |
Min Width of Slot Hole (PTH) | 0.6mm | |
Solder Mask | LPI, different colors(Green, Black, White, Red, Yellow, Blue, Purple, Matt Black, Matt Green) | |
Silkscreen Color | White,Black | |
Surface Finish | HASL, Lead Free HASL, ENIG (1-3 micro inches), Immersion Tin, Immersion Silver, OSP | |
Max.Thickness of Au in ENIG | 2-5U" or >=5U" | |
Surface/Hole Plating Thickness | 20-25um | |
Board Thickness Tolerance | +/-0.1mm ~ +/-10% of thickness of board | |
Board Size Tolerance | +/-0.1mm~+/-0.3mm | |
PTH Hole Size Tolerance | +/.003*(+/0.08mm)~+/.006"(+/-0.15mm) | |
NPTH Hole Size Tolerance | +/.002*(+/-0.05mm) | |
Copper Thickness Tolerance | 0um ~ +20um | |
SM Tolerance(LPI) | .003"(0.075mm) | |
SMD Pitch | 0.2mm(8mil) | |
BGA Pitch | 0.2mm(8mil) | |
Aspect Ratio | 1:8 (hole size:board thickness) | |
Test | 10V-250V, flying probe or testing fixture | |
Inspection Standard | IPC 2 IPC 3 | |
Deliver Method | Single board without technical rail Single board with technical rail Panel with technical rail Others | |
UL Marking | Marking of UL on board | |
Impedance Control | Impedance control tolerance:Regular impedance Control +-10% Non-Regular Control +-5% | |
Gold Fingers | Gold Fingers Chamfer:0° 20° 30° 45° 60° |