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PCB Resources

Your comprehensive PCB knowledge resource. Explore in-depth guides on PCB design, material selection, fabrication techniques, and industry trends. Empower your PCB expertise today! 

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PCBA Resources

PCBX: Master the art of PCB assembly. Delve into expert guides on PCB assembly processes, techniques, and quality control procedures. Elevate your PCB assembly skills now! 

PCBA Resources - PCB Expert Manufacturing - PCBX

PCB Design

The PCB Design Resource Channel is a worthwhile location that provides electronic engineers and designers with top-notch resources and tools to design printed circuit boards. In this section, the latest guides in design, tutorial videos, software tools, example projects, and best practices are organized together for reference on how best to go about optimizing the design process for better work efficiency and product quality.

PCB Design - PCB Expert Manufacturing - PCBX

Comprehensive Guide to PCB Panel Creation

Panel creation, more appropriately called panelization of a Printed Circuit Board, is the process of compiling several individual PCB designs into one larger board commonly known as a panel. It is more than just space-saving - an approach aimed at improving manufacturing efficiency and therefore reducing material waste to reduce production cost. The following tutorial will help a person-whether a learner or an experienced one-understand the creation of a PCB panel, from basic concepts and specific types of panels to the techniques involved, in order to get a perfect sense of the concept.<h2>Need for the Creation of PCB Panel</h2><h3>Why Panelization?</h3>The main problem-or better said-the motive for creating PCB panel creation is to make the process of manufacturing easier. Placing several smaller PCBs together into one big panel facilitates-and saves time for-the manufacturer. Advantages involved include:Improved Manufacturing Yield: A single large panel is much more convenient to handle in a manufacturing process than many small boards.Economic Advantages: Material wastage is minimized due to the fact that unused space between individual PCBs in a panel will be at a minimum.Easy Assembly and Testing: This makes it easier in SMT assembly and testing since multiple boards are processed in one run.<h3>Types of PCB Panels</h3>Common Panel TypesDifferent panelization techniques fit various requirements and PCB designs. Among the major types of panels are:V-scoring/V-cut/V-groove:<img src="https://img.pcbx.com/dev/file/image/article/20240918/1124adee80154a2eb87ac2e8b92d9c2c.png" alt="V-scoring-PCBX" data-href="" style="width: 100%;"/>Description: A 'V' groove between boards, the method gives good results when the board snaps off easily. It could be appropriate for PCBs whose edges are just plain and straight.Application: Suitable for rectangular-shaped PCBs and is done on a V-cut machine. A cut is made through the full board continuously, so this technique can also be used for volume production.Routing Slot/Milling Slot + Tab (Tab-routing):Description: This is a process of milling slot in between PCBs while leaving some tabs to hold the PCB structurally. There are two kinds of tab-routing:Tabs with perforations/mouse bites that can be easily snapped.Solid tabs that need to be cut.Application: This method can be applied to the PCBs, which are of irregular shapes and sizes since the tabs will act like supporting edges, which can be easily snapped off when needed.Combination of V-scoring and Tab-routing:Description: This method shall be applied when a panel needs both methods for its completion owing to several design needs. For instance, V-scoring for the edges, which are straight while for other irregular shapes, tabs may be required.<img src="https://img.pcbx.com/dev/file/image/article/20240918/9fa5fa44ad49450585ccfb828a911f26.png" alt="Tab-routing-PCBX" data-href="" style="width: 100%;"/><h2>Rules and Tips to Carry Out Efficient Panel Design</h2><h3>Considerations During Design</h3>Some of the key design rules to consider when ensuring efficiency and quality in PCB panelization include:Panel Shape: The design should aim for a square or rectangle for convenience in handling and space maximization.Closed-loop Outer Frame: Ensuring that the panel retains its shape during a time-consuming manufacturing process.Components Placement: Large or protruding components should not be put near the connection point between the panel frame and the individual PCBs.Fiducial Marks: The panel should feature at least four fiducial holes, situated in its corners. These are for alignment purposes during the manufacturing process. The location must be accurate, and the sidewalls must be smooth to avoid structural weakness.Fiducial Points: There must be an area devoid of solder with a diameter greater than 1.5mm around each fiducial mark for viewing purposes.<h3>Mechanical Processing Techniques</h3>Scoring and MillingMultiplier Panel Scored:X Spacing: No spacing between PCBs. Where space is needed, a minimum 5.0mm spacing must be used.X Traces and Copper Areas: All traces and copper areas must be at least 500µm from the scoring edge.X Panel Thickness: For rigidity, it is advisable to use scoring on panels with the minimum thickness of 1mm.Multiplier Panel Milled:X Spacing: Leave a 2.0mm gap between PCBs.Bridges: If left undefined, the manufactures will place them optimally-usually 1.0-1.5mm wide.Traces and Copper Areas: Keep 200µm minimum distance from milling edge.Mixed Multiplier Panels:Description: Place various different PCB layouts together into one panel.Contours and Traces: Same spacing (0.0mm for scoring, 2.0mm for milling).Stability: Leave enough room for panel stability.<h3>Combining Techniques: Scoring and Milling</h3>Usage and RecommendationsCombination of scoring and milling techniques can provide solutions for complicated panel designs:Calculation of Spacing: Keep the spacing between scored parts as 0.0mm and that between milled parts as 2.0mm.Spacing on Edges: Keep all traces and copper areas at least 500µm from the scoring edge and 200µm from the milling edge.Tool Issues to Consider: It is best to avoid milling straight down a scoring line due to chip formation issues during manufacturing.<h3>X-out Management and Customer Involvement</h3>X-out Handling:Standard Practice: A defective PCB (determined through E-test) is left on the panel but is X-ed out.Customer Options: Customers, during the ordering process, have an option to NOT allow this process to ensure no marked defective PCBs are delivered.Customer-Driven Design:Panel Data: Customers may supply their panel configuration or use manufacturers' online tools for exacting panel assembly.Configurator Tools: These are the tools that give a preview about the design of a panel to facilitate the panelization process. This is done so in order to ensure customer satisfaction.<h2>Conclusion</h2>PCB panel creation is an essential part of modern electronic manufacturing. It is an amalgamation of art and science put together with an objective of enhancing efficiency that would reduce the cost and best methodology of assembly. Understanding various methods and best practices for panelization would ensure high-quality, cost-effective PCBs both by designers and manufacturers. You will become proficient in the creation of a panel for the PCB, taking into account the types of panels that may be produced, the mechanical processing methods involved, and some of the essential design rules, thus getting the many benefits accruable from using them in manufacturing.

PCB panelization consolidates multiple PCBs into a larger board, improving manufacturing efficiency and reducing waste. Techniques include V-scoring and tab-routing. Proper design enhances assembly, testing, and cost-effectiveness.

What is the Difference Between Pad and Via? 

Printed Circuit Boards presently play an important role in modern electronics, enabling complicated circuits to become compact, reliable, and efficient. In the case of the Printed Circuit Boards, there are two critical elements: Pads and vias, which serve different unique and essential functions. Although they always come in a pair, they are for different functions concerning the board layout. Understanding these differences will be crucial to effective PCB design and manufacturing.<h2>What is a Pad?</h2>Pad or soldering pad is, on a PCB, an area to which the lead of a component or the terminal is to be soldered. These small exposed areas of metal form an integration point for components, land pattern - binding or positioning it, and electrical attachment to the board.<h3>Types of Pads</h3>Pin Pads: Pin pads are the kind of pads with soldering holes. They are basically utilized for through-hole components. Such components have their leads through the board to the opposite side, where they are soldered on.Surface Mount Pads: Surface mount pads do not contain soldering holes. They are used for surface mount technology components, which are soldered directly onto the pad atop the board.A Pad performs the function of mechanically and electrically securing components to the board with reliable connectivity in the circuit. <h2>What is a Via?</h2>A via, or vertical interconnect access, is a small hole drilled into the PCB for connecting traces between different layers. Vias are very important in multi-layer or double-sided boards to route signals or voltages vertically through the board in order to connect various layers.<h3>Types of Vias</h3>Plated Through-Hole (PTH) Vias:These vias run from the top layer to the bottom layer and connect all the layers in between.Blind Vias:Blind vias are those extending from an outer layer either from the top or bottom to one or more inner layers without reaching the opposite side.Buried Vias:Buried vias come totally within the inner layers of a PCB and never reach either of the outer layers.Microvias:Very tiny vias, and usually laser-drilled. Microvias are a feature of High-Density Interconnect HDI PCBs.The main function of vias, however, is to route signals across multiple layers of PCBs, hence enabling more complex and compact designs.<img src="https://img.pcbx.com/dev/file/image/article/20240916/9493aef1988f4c32934e94adbe520a38.png" alt="Pads and Vias-PCBX" data-href="" style="width: 100%;"/><h2>Key Differences Between Pads and Vias</h2>Understanding the differences between a pad and a via is indispensable for any professional dealing with the design of printed circuit boards :Function and Purpose:Pads: Represent the main soldering points for components and provide the required mechanical and electrical connections on the surface of the board.Vias: These provide electrical interconnection between different layers of the printed circuit board. They make multi-layer routing possible without using any surface area.Structural Considerations:Pads: They are meant to be mechanically strong enough to bear the severe stresses during the installation of the components and while soldering them, so that for this reason they have a sufficient diameter, to allow the lead of the component end.Vias: Smaller apertures are needed, focusing on keeping electrically joined layers together. The smaller vias sometimes may be more expensive because of precision in drilling and plating processes.Design Considerations:Pads: There is a need to ensure spacing appropriately, pad diameters, and solder mask clearance for good soldering and reliable connections.Vias: Consider thermal and electrical properties, minimize problems such as noise and reflection in signals. This is achieved by the optimal implementation of via size, its placement, and dimensions of the annular ring.<h2>Detailed Insight into Pads</h2>The size of the aperture in the Pad should be at least big enough to clear the component pin. Because the drilling process can be a bit sloppy, the aperture will, in general increase about 0.15 mm. So for example, with a designed hole diameter of 0.5mm, after drilling it could be around 0.65, so the final aperture would be approximately 0.55mm after copper immersionRegarding the Pad structure, there should be at least 0.20 mm width in the soldering ring to ensure reliable adhesion and electrical connectivity.<h2>Detailed Information on Vias</h2>Vias are involved with a high level of drilling and plating art in manufacture. Within most Chinese PCB manufacturing enterprises, the general PTH diameter is about 8 mil (0.2 mm), while BVH has a diameter of 4 mil (0.1 mm). Because of the production process, the final actual aperture of a via will be about 0.1 mm less than the size planned for it. That is to say, after the copper immersion process, a via designed to be 0.5 mm in diameter may have an actual diameter of about 0.4 mm. Usually, in order to ensure good electric connections, the soldering ring of the via should be at least 0.15 mm wide.<h3>Via-in-Pad</h3><img src="https://img.pcbx.com/dev/file/image/article/20240916/d9a58de7de524938aef79a51a8976f52.png" alt="Via-in-Pad-PCBX" data-href="" style="width: 100%;"/>In high-density PCB design, space optimization is critical, and creative routing solutions often used include via-in-pad. In via-in-pad design, vias are placed underneath the surface mount component pad. This helps to provide space on the surface for other components and can help towards better routing efficiency, thermal dissipation, and inductance reduction.However, via-in-pad designs are more challenging and more expensive. Via size is also a critical issue because larger vias can have unnecessarily high resistance. Vias need to be placed correctly to reduce noise without impacting signal integrity; annular rings should also be suitable to maintain electrical and thermal integrity. Moreover, the solder mask design too needs to be such that it prevents solder from wicking into the via itself during the assembly.<h2>Conclusion</h2>Understanding the difference between pads and vias is very important for effective PCB design. While pads are responsible for component placement and electrical connections along the board surface, vias provide interlayer connections, very important in multi-layer PCB designs.While both pads and vias are used for different purposes, appropriate design and implementation of the same are quite important for the development of reliable and high-performance PCBs. From simple single-layer boards to complex multilayer designs, recognizing and appropriately using the respective functions of pads and vias will do much good in efficiency and functionality for your electronic project.By mastering these aspects, PCB designers can make well-informed choices that optimize both the design and manufacturability of their boards, ensuring robust performance and cost-effective production.

Pads and vias are crucial for PCB design: pads serve as soldering points for components, while vias connect different layers. Understanding and correctly implementing them ensures reliable, efficient, high-performance PCBs.

What is the Difference Between Pad and Via in the PCB? 

Printed Circuit Boards form the backbone of our modern electronic gadgets. Very intricately designed and fragile, they are unfortunately prone to corrosion, often leading to performance degradations, malfunctioning, or even complete failure. This article describes how to deal effectively with circuit board corrosion.<h3>Understanding Circuit Board Corrosion</h3>Corrosion is one of the most common happenings in electronics, owing to reactions between the environment and the metal parts of the board. The presence of moisture, oxygen, and contaminants can initiate the oxidation of metals, thus leading to corrosion. Following are a few common forms:Galvanic Corrosion: This occurs between two dissimilar metals when the conditions are moist and these come into contact.Pitting Corrosion: Characterized by the metal showing small holes or "pits".It occurs in areas, such as narrow grooves, where water may stagnate.<h3>Signs of Corrosion on Circuit Boards</h3>Early detection of corrosion can save your electronics. Look for:Colored or fuzzy areas on the board .Strange smells-many times a symptom of an advanced stage of corrosion.Disturbed flow of electricity-resulting in erratic behavior or complete failure.Overheating because of the increased resistance.Before cleaning, ensure safety and preparation for cleaning are accounted for with the following: Switch off all power sources to your device and remove batteries if necessary.Carefully disassemble your device to access the circuit board by documenting what parts go in where for easier reassembly later.Keep your workspace clean so that you can find all parts when you put back the device.<h3>Things You Will Be Needing</h3>To clean the corrosion on a circuit board, you will need the following material:Isopropyl alcohol of at least 90%Soft brush, preferably a toothbrushCotton swabsGloves to wearPrecision screwdriversA tray to lay all the pieces in<img src="https://img.pcbx.com/dev/file/image/article/20240913/5fc1d04c4e7c4d4ab94d8aca8ca2c538.jpg" alt="how to clean pcb-PCBX" data-href="" style="width: 100%;"/><h3>Step-by-Step Corrosion Cleaning</h3>Loose Corrosion RemovalTake a soft-bristled brush and gently sweep off any loose corrosion. Avoid hard scrubbing as it may cause damage.Isopropyl Alcohol ApplicationDip the cotton swab in isopropyl alcohol and lightly scrub the corroded area. Be able to reach into tiny crevices. Isopropyl alcohol breaks down corrosion, and its evaporation rate helps reduce the risk of water damage.Application of Alternate Cleaning SolutionsIf isopropyl alcohol is unavailable, mix vinegar and baking soda together for effectiveness. Apply the paste to corroded areas and scrub gently with a soft brush. Then, rinse with deionized water and make sure the board is completely dry before reassembling.<h3>Drying and Reassembling Your Circuit Board</h3>Ensure It is Completely DryRemaining moisture encourages further corrosion. To hasten the drying process, use a hairdryer or low-heat compressed air. If in doubt, check for moisture with a multimeter.Reassembly and TestingReassemble your device carefully, putting everything in its place. Patience is very important to avoid mistakes. Test the device for functionality. If problems persist, you may have to disassemble and clean again.<h3>How to Prevent Future Corrosion</h3>Routine Maintenance and InspectionCheck your circuit boards from time to time for any signs of corrosion. Cleaning it immediately can stop further damage from setting in.Environmental Controls and Protective CoatingsKeep electronics in a cool, dry place. Use silica gel packets to absorb moisture. Protective coatings can create a barrier against corroding substances. Whenever applying protective coatings, follow instructions by the manufacturer.<h3>When to Seek Professional Help</h3>If the corrosion is more serious or beyond your league, then seek professional help. Professionals have proper equipment and may deal with hard corrosion, sometimes replacing worn-out components.<h3>Conclusion and Final Checklist</h3>Cleaning corrosion from a circuit board is an intimidating but quite doable job with proper tools and advice. As you wind up, make sure you have:cleaned the board using a soft brush,Applied isopropyl alcohol or other cleaning solutions.Dried the board perfectly.Reassembled the device correctly.Applied preventive measures.Cleaning electronics successfully calls for patience and a soft touch. If in doubt, consult professional service.

Printed Circuit Boards (PCBs) are crucial yet prone to corrosion, leading to malfunctions or failures. This article outlines detecting corrosion signs, preparing for cleaning, required materials, and step-by-step cleaning methods using isopropyl alcohol or alternatives. It also covers drying, reassembly, and preventive measures. Seek professional help if corrosion is severe.