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PCB Resources

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PCBA Resources

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PCB Design

The PCB Design Resource Channel is a worthwhile location that provides electronic engineers and designers with top-notch resources and tools to design printed circuit boards. In this section, the latest guides in design, tutorial videos, software tools, example projects, and best practices are organized together for reference on how best to go about optimizing the design process for better work efficiency and product quality.

PCB Design - PCB Expert Manufacturing - PCBX

In this highly complex world of new-generation electronics, printed circuit boards (PCBs) have become the foundation. In computerized devices, mobile gadgets, and any kind of industrial machinery used in today's modern world, the transmission of digital signals is very important. Gold fingers are the crux of this connectivity; they are narrow, gold-plated connectors positioned along the edges of PCBs. This all-inclusive guide to PCB gold fingers gives all the details to understand gold fingers, their importance, types, the gold-plating process on them, and their diverse applications.<h2>What are Gold Fingers of Printed Circuit Boards?</h2>Gold fingers are the edge connectors in PCBs that are plated in gold. These are interface points into other boards or components for proper communication and flow of power. These fingers are normally made from hard gold, which is to say gold that has been electroplated, so as to take the pushing and shoving in and out without failure. The normal thickness for gold is from 2 to 50 microns. Which thickness should be used is dependent on what application it is being used for.We use gold for these connectors as it has the best corrosion resistance and is an excellent electrical conductor. It is relatively hard and durable and is often alloyed with nickel or cobalt for even greater hardness and durability, so the fingers are created to be extremely hardy and to survive for long periods under heavy use.<img src="https://img.pcbx.com/dev/file/image/article/20240912/89165b69b86d4a47a091d17a492961b1.jpg" alt="Gold Fingers-PCBX" data-href="" style="width: 100%;"/><h2>Type of Gold Fingers</h2>The ways of making the finger pads differ mainly in the gold plating thickness and the hardness:Electroplated Hard Gold: Suited for the most demanding of applications where contacts need to be mated over and over again, this process results in a deposit of approximately 30µ inches of hard gold that has excellent resistance against wear.Electroless Nickel Immersion Gold (ENIG): Although this process is far more economical than plating with hard gold and easier to solder, the yield golf is much softer and not recommended for most high-abrasion contacts. It's generally plated from 2 to 5µ inches.<h2>The Manufacturing Process: From Concept to Connection</h2>The Gold Fingers Plating process is voluminous and gives a constant high-quality product due to the following important steps: Nickel Plating: This is the first process in which a layer of nickel up to 2 to 6 microns deep is put over the connecting edges of fingers. This base layer acts as a substrate to improve adhesion and endurance of the gold layer, which follows.Gold Plating: A hard layer of gold (generally compounded with cobalt to make it harder) is elec­troplated over the nickel. The thickness is in the order 1 to 2 microns.Beveling: The edges of the fingers are bevelled at a specific angle (usually about 30 to 45 degrees) to enable free entry into their slotted count­erparts.<h2>Post-Plating Inspections and Tests</h2>Each PCB undergoes a series of testings and inspection to determine the quality of the gold plating:Visual Inspection: This is done using magnifying glasses where the smooth and clean contact edges have to be checked.Adhesion Test (Tape Test): This is done by attaching a strip of the tape to gold plated contact edges, then removing it hence gets inspected for the presence of the gold on the tape hence helps in determining sufficiency in the plating adhesion.<h2>Design and Specifications</h2>Gold finger design on PCBs shall strictly be within specific dimensions and per particular standards for proper performance:No PTH (plated through-holes) or pads shall be closer than 1mm from the gold fingersBetween the gold fingers and the PCB, there should be a space distance of 0.5mm.From the edges of the PCB, there shall be at least an exclusion of the inner copper layers so that they don't be exposed during beveling.The total length for gold fingers for plating has been taken to be of 40mm.<img src="https://img.pcbx.com/dev/file/image/article/20240912/617a78a16e914763a111b7ba715325e5.png" alt="Gold Fingers Design-PCBX" data-href="" style="width: 100%;"/><h2>Uses of Gold Fingers</h2><h2>Gold fingers are used in various other sectors. Some of its uses are given below:</h2>In-House Connections: The motherboard is connected to the main PCB with the help of secondary PCB, and such PCB has the gold fingers which slide into the female connections PCI, ISA or AGP.Special Interfaces: It is used in special booster peripheral equipment such as soundcard and graphics card.Peripherals: Gold fingers can be found at the edge of the motherboard. The use of gold fingers in the motherboard enables peripheral devices, such as the monitor, printer, USB devices, and even speakers, to be inserted into the motherboard slots, and allows these devices to be frequently plugged and unplugged.<h2>Types of Gold Fingers in Specialised PCBs</h2>Segmented or unequal of gold fingers can exist for special PCBs:Non-uniform Fingers: For example, in memory card readers, where shorter fingers have been designed so that some parts of the device can receive power supply before other parts.Segmented Fingers: These segmented connectors are used primarily in rough and waterproof electronics, that too, in very selective applications where a higher degree of rugged utilization is needed.<h2>Gold Finger Standards and Regulations</h2>Association Connecting Electronics Industries–IPC has taken initiatives to develop standards to ensure quality and reliability of PCB gold fingers :Chemical Composition: The gold plating that is characterized by maximum edge rigidity shall consist of 5 to 10% cobalt.The gold thickness needs to range from 2 to 50 microinches. Selected single requirements are 0.031 inches, 0.062 inches, 0.093 inches, and 0.125 inches.Tape and Visual Tests: This will ensure the plating can't be ripped off, plus it's uniform, and adheres well.<h2>The Collision of Technology and Formulation</h2>Currently, gold fingers are used in consumer and industrial machinery, from personal computing devices to manufacturing machinery. Robotic arms and other automated systems get their required power and signal from gold fingers. In consumer electronics, they ensure a smooth interface of so many devices, contributing to techno advancement.The gold fingers have become the indispensable making element of solid, reliable connections in wide ranges of application inside modern electronics. Due to their excellent conductivity and durability, as well as conformance with high standards, they are applicable in popular devices and complex industrial systems. With great production quality and rigid testing protocols, the manufacturer, Gold Fingers, goes a step further in assisting the big strive for innovations in many fields, which sets the golden standard in PCB technology.

Gold fingers are essential gold-plated edge connectors on PCBs, known for durability and conductivity, crucial for transmitting digital signals in electronics. They come in Electroplated Hard Gold and ENIG types. Used in motherboards, peripherals, and industrial machinery, they adhere to IPC standards ensuring reliable, high-quality connections in modern electronic devices.

The Essential Guide to PCB Gold Fingers

Designing a printed circuit board is an intensive, step-by-step process that requires a lot of thought, detail, and the right pack of tools. Here's the complete guide on how to take your ideas from concept to finished product with the help of the following ten important steps. <h2>Step 1: Schematic Capture </h2>This phase of schematic capture, you will begin to develop the blueprint stage, either starting with a template or creating a design from scratch: Component selection: Select components according to the requirement of the circuit. Symbols and Footprints: Either design or import, if necessary, schematic symbols and footprints. Schematic Drawing: Place CAD tools drawing on the schematic sheet; draw electrical connectivity from one component to another. Annotation and Net Naming: Properly annotate and label your components and nets whenever there is a need. This becomes particularly useful in complex designs and helps one keep the connectivity clear and organized. Simulation Run simulations using tools like SPICE to make sure that your design works before moving to the next step. <h2>Step 2: Create a Blank PCB Layout </h2>Next you're going to create the layout where your schematic is going to come to life. Create a PcbDoc File: Open up a new PCB document in your CAD tool. Define Board Outline: Shape and dimension the board according to the needs of the project. Import Schematic Data: Import component and connection data from your schematic into your PCB layout document. <img src="https://img.pcbx.com/dev/file/image/article/20240829/9cd0c4ab1ee54523bcf25428d6de6406.JPG" alt="Blank PCB-PCBX" data-href="" style="width: 100%;"/><h2>Step 3: Update Your PCB Design with Schematics </h2>To ensure that the changes you made to your schematic properly reflect in your PCB layout: ECO Process: The Engineering Change Order process synchronizes the schematic and PCB files. All components and connections in the layout get updated. <h2>Step 4: Designing Your PCB Stackup </h2>Define physical layers and materials of your PCB: Layer Setup Manager: Designer will use Layer Setup Manager for defining the signal, power, and ground layers. Material selection: Materials can be selected from the library that fits best the design requirement. For example, FR4 will be used for the standard board. Impedance control: In designing high-speed or high-frequency circuits, use impedance profiler to ensure correct trace impedance. <h2>Step 5: Definition of Design Rules and DFM Requirements of a PCB </h2>Configure the rules to ensure that your PCB is manufacturable and functions correctly, including: Clearance Rules: Define minimum distances between different elements. Size Constraints: Specify minimum and maximum sizes for vias, traces, pads, and other features in your design. High-Speed Constraints: Set overshoot limits and other signal integrity constraints for high-speed signals. Fabrication Constraints: The rules are tailored to meet the specifications of your PCB fabricator. &nbsp;<h2>Step 6: Place Components </h2>Arrange the components on your PCB: Auto and Manual Placement: Use automated and manual placement tools to obtain the best possible placement of components. Grouping Components: A feature to be used with a view to group related components in ways that make your design easier to follow and improve the overall signal path, hence the performance of your circuits.<h2>Step 7: Add Drill Holes</h2>Define where drill holes and vias will be on the board:Drill Holes and Vias: Place these based on your design and mechanical requirements. Modify them as needed while routing.<h2>Step 8: Route Traces</h2>Connect components electrically by routing traces:Routing Strategy: Critical connections like power, ground, and high-speed nets must be given priority.Routing Tools: CAD tool advanced routing features can be used to draw traces quickly, while following all the design rules. Automatic routing is possible to speed up this step if the number of connections is large.<img src="https://img.pcbx.com/dev/file/image/article/20240829/18ace9fa33034af7aad2b5b2039e4e94.jpg" alt="PCB design-PCBX" data-href="" style="width: 100%;"/><h2>Step 9: Adding Labels and Identifiers</h2>Label your PCB. This will help in assembling and testing:Reference Designators: Put these in if you need to know which component is which when assembly. Other Markings: Add polarity indicators, pin one identifiers, logos, part numbers as needed Silkscreen Layer: Put all labels and markings into the correct overlay layers.<h2>Step 10: Generate Design Output Files </h2>Generate the files that will be used by the manufacturer for the board. Run a final Design Rule Check: This is the last check for errors.Generate Gerber Files: Generate Gerber files, Bill of Materials, and drill files (if required) for fabrication. These should include all information and instructions that are to be conveyed to the manufacturer.<h2>Final Steps: Fabrication and Assembly</h2><h3>Fabrication</h3>Send Files: Send your final files to the PCB fabrication facility.Board Production: The facility will create a bare PCB, which etches traces and creates a layer stackup.<h3>Assembly</h3>Component Placement and Soldering: The assembly facility places the components on the board in their respective positions, following soldering.Test and Inspect: The assembled PCB is tested comprehensively and inspected to ascertain the conformance of the board to design specifications and its operability according to stipulated needs.Using these ten steps, you will be able to work through a process of PCB design in a manner where all phases are properly addressed and integrated. The orderly approach allows you to minimize errors, enhance functionality, and ensure manufacturability toward a final product.

Designing a PCB involves ten detailed steps: schematic capture, creating a blank PCB layout, syncing designs, defining stackup, setting design rules, placing components, adding drill holes, routing traces, labeling, and generating output files. These steps ensure an organized, error-free process from concept to manufacturing.

How to Design a Printed Circuit Board

While semiconductor integration is ever-increasing, system-on-chips are still inapplicable for all applications. Ready-to-use boards are powerful and even more easily available; however, many electronic products still demand customized PCBs. Used as the physical design platform and the most flexible part of a PCB in electronic system design for original components, even an ordinary one could play a very important role in one-time development. The article describes ten golden rules that one should consider while using design software for PCB layout design and commercial manufacturing. Most of those rules remain unchanged since commercial PCB design was invented 25 years ago, making them greatly valuable in guiding electronic design engineers and mature circuit board manufacturers. <img src="https://img.pcbx.com/dev/file/image/article/20240725/c6605d4f5f944792a8e8ff9453908d39.png" alt="Ten golden rules of PCB design - PCBX" data-href="" style="width: 50%;"><h2>Rule 1: Select the right grid set that matches the most components. </h2>Although the multi-grid seems very effective, engineers could avoid problems encountered in the setting of intervals at the early stage of PCB layout design if they had more thought, which could maximize the application of a circuit board. Because many devices use numerous package sizes, engineers should select the product that best fits their design. When polygon copper is used on multi-grid circuit boards, polygon filling deviations are common, not as standard as those based on a single grid but providing more than the required amount of circuit board life. <h2>Rule 2: The route shall be the shortest and most direct. </h2>This might sound simple and common, but it needs to be kept in mind at every stage, even if one needs to change the circuit board layout to optimize the wiring length. <h2>Rule 3: The power layer is preferable to control distribution of the power lines and the ground lines. </h2><img src="https://img.pcbx.com/dev/file/image/article/20240725/950f2203720c424bb6704f3a2dc104b9.png" alt="The power layer is preferable to control distribution of the power lines and the ground lines - PCBX" data-href="" style="width: 50%;">The power layer copper typically provides a quicker and easier way in most PCB design software to ensure the current flow with minimum impedance or voltage drop for maximum efficiency by interconnecting wires in common and ensuring sufficient ground return paths. <h2>Rule 4: Keep related components together with their required test points. </h2><h2>Rule 5: Duplicate the target circuit board on a larger circuit board to allow PCB imposition. </h2>The size that best fits the equipment will cut down on the cost of prototyping and manufacturing tremendously. Because the circuit board layout on the panel matters, you need to ask the circuit board manufacturer for their preferred size specification on each panel, then change your design specifications to those and see if you can repeat your design multiple times within these sizes. <h2>Rule 6: Combine component values. </h2>Of course, as a designer, you will choose discrete components with greater or lower values based on component values but behave similarly. More fall within an integrated standard value range, simplifying the bill of materials and lowering associated expenses. If you have a series of items in your PCB line depending on the value of your chosen version of the component, you will be better able to make long-term inventory management decisions. <h2>Rule 7: Frequent design rule checks (DRC) </h2>Running the DRC function of PCB software frequently is a good habit. It takes little time, but it saves a lot of time even in a more complicated design environment, as long as you always check while designing. <h2>Rule 8: Use silkscreen flexibly. </h2>Silkscreen can be used to mark useful information for circuit board manufacturers, service or test engineers, installers, or equipment debuggers. Not just clear function and test point labels; after the circuit board has been assembled, you can also indicate the direction of components and connectors wherever possible with these comments printed on the lower surface of the components used on the circuit board. The entire application of silk screen technology on the upper and lower surfaces of the circuit board helps avoid repetitive work and, hence, makes things easier in the process. <h2>Rule 9: Selecting the decoupling caps. </h2>Do not try to optimize your design by avoiding decoupling the power lines based on the limit values in the component datasheet. The capacitors are inexpensive and long-lasting. You can afford to spend as much time as possible assembling the capacitors. To keep your inventory neat, follow Rule 6, which states that you should use the standard value range. <h2>Rule 10: The PCB parameters must be checked before submitting for production. </h2><img src="https://img.pcbx.com/dev/file/image/article/20240725/6e0163a62cf84d8aa8ea7ea8ff94132e.png" alt="pcb check - PCBX" data-href="" style="width: 50%;">Although most circuit board manufacturers download the uploaded files directly to verify the parameters, it is still better to output the Gerber file by yourself and verify it with a free viewer to reduce the risks of misunderstandings. You may even find some negligent errors and avoid losses caused by production according to the wrong parameters.

The article is developed concerning the breakthrough of integrated circuits and the need for custom PCBs in some electronic products. It enumerates ten golden rules in conducting PCB layout design and manufacturing: grid selection, routing, power layers, component placement, panel duplication, component value combination, frequent DRC, flexible silkscreen use, decoupling capacitors, and pre-production parameter checks. These rules provide for the optimum design and manufacturing of a PCB.