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Your comprehensive PCB knowledge resource. Explore in-depth guides on PCB design, material selection, fabrication techniques, and industry trends. Empower your PCB expertise today! 

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PCBA Resources

PCBX: Master the art of PCB assembly. Delve into expert guides on PCB assembly processes, techniques, and quality control procedures. Elevate your PCB assembly skills now! 

PCBA Resources - PCB Expert Manufacturing - PCBX

PCB Design

The PCB Design Resource Channel is a worthwhile location that provides electronic engineers and designers with top-notch resources and tools to design printed circuit boards. In this section, the latest guides in design, tutorial videos, software tools, example projects, and best practices are organized together for reference on how best to go about optimizing the design process for better work efficiency and product quality.

PCB Design - PCB Expert Manufacturing - PCBX

In the realm of electronics, one of the most important processes involves chip packaging. This is where all electronic components are used, such as chips, transistors, resistors, and capacitors, molded in forms and sizes for ease of use, hence mounted easily on a printed circuit board, offering considerable mechanical protection, providing electrical connections, and offering good thermal management. This tutorial takes an in-depth look into the complexities of IC packaging, covering its importance, common types, and aspects one considers when choosing the right package for one's application.<h2>What is IC Packaging?</h2>The packaging of ICs acts as the final stage in the process of semiconductor device fabrication. It encapsulates the fragile silicon die in which a functional circuit is fabricated within a protective case for protection from physical damage, corrosion, and environmental factors such as moisture and dust. The packaging process also allows for electrical interconnections between IC and the PCB and thermal management for efficient operation.<h3>Importance of IC Packaging</h3>Protection: It safeguards the integrated circuitry against mechanical damage and environmental influence. Electrical Connection: It provides the pins or leads through which the IC is connected with other circuits. Thermal Dissipation: It helps to dissipate the heat produced by IC functioning. Form Factor: Assorted sizes and shapes render it suitable for different applications. <h2>Common Types and Sizes of IC Packages </h2>IC packages are categorized based on their application area and functional capabilities. Common categories include the following :<h3>Surface Mount Device (SMD)</h3>SMD packages are for Surface Mount Technology, where components are directly mounted onto the surface of a PCB without protruding pins.Quad Flat Package (QFP)Description: The QFP has a larger PCB outline in both length and width with pins on all four sides.Sizes: The common sizes include 7x7mm, 10x10mm, 14x14mm.Pin Count: Ranges from dozens of hundreds.Applications: It is used for ICs, integrated circuits, microcontrollers, and processors.<img src="https://img.pcbx.com/dev/file/image/article/20240912/8af1e2a2abd4492ea9f419fbf3543783.jpg" alt="IC Package QFP-PCBX" data-href="" style="width: 100%;"/>Ball Grid Array (BGA)Description: A BGA package has a grid of solder balls underneath.Pitch: 0.75mm to 1.0mm, and general usage pitches fall within this range.Pin Count: Ranges from dozens of pins to hundreds of pins.Features: It provides excellent heat dissipation and electrical performance.Application: Apply to high performance and large-scale integrated circuits.<img src="https://img.pcbx.com/dev/file/image/article/20240912/a4c12c27fd6345a880e3c07bbea1426d.jpg" alt="IC Package BGA-PCBX" data-href="" style="width: 100%;"/>Small Outline Integrated Circuit (SOIC)Description: Small in shape, with small-pitch pin layout.Sizes: Generally, 3x3mm, 5x5mm, 7x7mm.Number of Pins: Generally in the range of 8 to 48.Applications: Suitable for medium-scale integrated circuits.<img src="https://img.pcbx.com/dev/file/image/article/20240912/1438c5652d644f45bb240a0b427c211e.jpg" alt="IC Package SOIC-PCBX" data-href="" style="width: 100%;"/><h3>Through-Hole Technology (THT)</h3>The Through-hole packages have pins that pass through pre-drilled holes in the PCB and soldered on the other side for making reliable mechanical and electrical connections.Dual In-line Package (DIP)Description: Two parallel rows of pins in a rectangular package.Sizes: Generally 7.62mm pitchNumber of Pins: 4 to 64.Applications: Extremely broad applications in consumer electronics, industrial machinery, and automotive. <img src="https://img.pcbx.com/dev/file/image/article/20240912/1ff5c09a3141447fa72dd7f24cb85c27.jpg" alt="IC Package DIP-PCBX" data-href="" style="width: 100%;"/>Single In-line Pin Package (SIP)Description: One row of pins issued vertically along the edge.Common Variants: SIP, SSIP, HSIP.Applications: Network resistors, RAM chips. <img src="https://img.pcbx.com/dev/file/image/article/20240912/ba19a6e34fdf41109c570f959a7f4c7f.jpg" alt="IC Package SIP-PCBX" data-href="" style="width: 100%;"/>Zig-Zag In-line Package (ZIP)Description: SIP-like package with zigzag folded pins.Common Variants: ZIP, SZIP.Applications: Memory modules, custom IC applications. <h3>Other Types of Packages</h3>Chip-on-Board (COB)Description: Chip is directly mounted on the PCB.Applications: Used in compact equipment and products where high integration is required.Plastic Leaded Chip Carrier (PLCC)Description: Very integrated digital circuits.Sizes: About 20x20mm.Pin Count: Varies between 20 and 84.Applications: Smaller designs for high-density PCBs.<img src="https://img.pcbx.com/dev/file/image/article/20240912/8eea3c3ea0d94150965bbdd85a71436a.jpg" alt="IC Package PLCC-PCBX" data-href="" style="width: 100%;"/><h2>Information about Packaging of ICs</h2>Some of the key information usually packaged in IC packages includes:Type and Size of Package: Type of package and its measurement in length, width, and height.Pin Configuration and Pin Count: The configuration of pins and number traces the component functionality and type of interfacing. Type of Material Used: This impacts mechanical strength and also affects the thermal performance of the package.Pad Information: Information like pad location, shape, and size for soldering is depicted.Thermal Management: Parameters for heat dissipation so that operational temperature is maintained.Package Identification: Manufacturer's logo, model number, date code for traceability.Pin Function: Pin functions are described for correct circuit connections.Environmental Adaptability: The various environments the package can withstand, such as waterproof and dustproof.<h2>Standards for IC Packaging</h2>IPC 7351: Defines the physical size, pin layout, and pad design of standard SMD component packages.ANSI Y32.2-1975: Lists the symbols of various electrical and electronic components.ISO 10303-21: STEP file format for 3D CAD model standardisation.<h2>Guidelines to Design IC Package</h2>Package Dimension: The size and shape of the package must be according to a particular component specification.Pin Placement: No two pins should be overlapped and collocated, the spacing between every two pins should be large enough for easy soldering.Pad Design: Proper pad size and shape ensures welding quality and reliability.Thermal Management: Provide appropriate heat sink structures for the high-power component.Symbol Marking: Proper symbolic marking helps to make identification and design easy.3D Modeling: Allows for PCB modeling and collision detection.Prohibited Areas: Allocate enough prohibited areas in every PCB to avoid component collisions.Manufacturability: Pay attention to limitations with regard to manufacturing and assembly during design.&lt;button class="center btn-lg" data-href="/order/manufacturing/pcba"&gt;Get an Instant Quote for Your Customized IC Packaging&lt;/button&gt;<h2>Choosing the Right Package of IC </h2>Variety of IC Packages Available:Surface Mount Technology (SMT) finds applications in small-sized electronic equipment such as smartphones, tablets.Through-Hole Technology (THT) is best fitted for large electrical and mechanical connections, such as in systems for industrial control. SiP stands for System-in-Package, which integrates many functional modules for higher integration and performance. BGA, or Ball Grid Array, is a surface-mount package with a high-density solder ball array, fitted for high-performance applications. Determination of Functional and Performance Requirements The signal integrity is very important when there is a high-frequency or high-speed signal; one should choose a package which has superior signal integrity.Size Restrictions: Match the size of the package with PCB layout to avoid installation problems.Cooling and Thermal ManagementHeat Dissipation: Choose appropriate packages with good heat-dissipation designs for high-power ICs.Layout and RoutingPinout Matching: Match your package to your layout to ensure good signal integrity and electrical interfaces.Cost and Supply Chain AvailabilityBalancing Cost and Performance: Make sure the chosen package fits within your project's requirement of budget and timeline.<h2>Conclusion</h2>Understanding IC packaging is a stepping stone to effectively designing the PCB. If you consider the type of package, size, pin layout, thermal management, and constraints at manufacture, you can correctly integrate components into a circuit. Being informed about the latest industry trends and standards will help you in making optimum decisions that will enhance performance and dependability for your electronic products.Be it the design for an industrial control system, automotive electronics, or any other application requiring difficult conditions, it is clear that IC packages offer solutions that really combine reliability with ease of operation. With the appropriate selection of an IC package, you can make a huge difference to the success of your PCB design project.

IC packaging is essential in electronics for protecting components, providing electrical connections, and managing heat. This tutorial explores its complexities, including its importance, various types like SMD, QFP, and BGA, and considerations for choosing the right package for specific applications. Proper IC packaging enhances PCB performance and reliability.

Comprehensive Guide to IC Packaging: Essential for Your PCB Designs

How to Get BGA Perfectly Soldered on PCBsP

Because BGA (Ball Grid Array) solder balls are hidden under the body, it’s not easy to inspect their performance. Up to now, Automated X-ray Inspection has been applied to help expose the defects of BGA solder balls including void, displacement, bridging, cold solder, etc. When flaws are discovered, rework must be implemented. However, rework is always expensive, which is not necessary for OEMs. As a result, the primary goal is to ensure the quality of BGA solder balls by efficiently preventing the formation of solder flaws. So, this article will discuss the key elements to be captured in the process of SMT assembly.It’s necessary to indicate that all the tips are summarized based on manufacturing experience in PCBX’s workshop. PCBX has been serving globe electronics for 20 years. Up to now, we’ve served more than 10,000 customers from over 80 countries and regions around the world with HIGH-RELIABILITY and LOW-COST bare PCBs and assembled PCBs that have been widely applied in numerous fields covering medical care, industrial control, transportation, military, aerospace, IoT, etc.<h2>Mechanism of BGA Soldering</h2>As the temperature rises over the melting point of the solder, the oxide layer generated on the pad's copper surface is cleansed as a result of flux activation. When properly applied, the copper surface and metal particles in the solder interact with one another. The cleaned pad surface is wetted with molten solder, resulting in a phenomenon known as chemical diffusion. This direct technique creates an IMC on the solder and pad surfaces.<img src="https://img.pcbx.com/dev/file/image/article/20240820/adb582bfa88b42f7b9b31a71c378dd07.PNG" alt="IMC-PCBX" data-href="" style="width: 100%;"/><h2>How to Achieve Perfect BGA Soldering in the SMT Assembly Process</h2>SMT assembly generally includes the following processes:<ul><li>Printing solder paste;</li><li>SPI (Solder Paste Inspection) - Optional;</li><li>Chip mounting;</li><li>Reflow Soldering;</li><li>AOI (Automated Optical Inspection);</li><li>AXI (Automated X-ray Inspection) Optional;</li><li>Rework Optional.</li><li>Major measures for optimizing BGA soldering during the SMT process will be implemented both before and during the process. The measures will be discussed in two parts: pre-soldering and during soldering.</li></ul><h3>Pre-Soldering</h3>PCB Board PreparationSurface Finish Selection: Select a surface finish compatible with project or product requirements. There are several surface finish possibilities that require introduction and comparison. Lead-free surface coatings such as lead-free HASL, ENIG, or OSP may be used on ROHS-compliant goods.Proper Storage and Handling: The board must be properly stored and handled. They should be placed in an electrostatic discharge protection bag with a moisture barrier and a moisture-sensitive indicator card. For humidity control inspection, an indicator card monitors the humidity within a bag in an easy and cost-effective manner. The card's color change reveals the relative humidity inside the bag as well as the efficacy of the desiccants. If the humidity within the bag equals or surpasses the indicator value, the circle turns pink.Baking and cleaning: Baking the PCBs can help prevent moisture defects during soldering. Maintain a temperature of 110±10℃ for 2 hours. Second, the handling process may result in dust being deposited on the boards, which are thoroughly cleaned prior to assembly. An ultrasonic cleaner is utilized at PCBX to ensure that the constructed PCBs are extremely clean, significantly boosting the board's reliability.BGA PreparationBDAs are moisture-sensitive components. They require storage at constant temperature and dry conditions. Many strict procedures have to be followed in the whole process in order not to damage the condition of the components by operating personnel. Normally, the BGA component should be stored in a moisture-proof cabinet at 20-25 with a humidity of 10%. It is advisable to use nitrogen.For the BGA components, some baking is required before soldering. The temperature should not reach 125 ℃ to avoid altering the metallographic structure of the components. Later, during re-flow soldering, higher temperatures may cause a disjunction between the solder balls and the component package, leading to lower SMT soldering quality. With an excessively low consortium temperature, moisture removal sometimes may prove impossible, which usually poses a problem. Thus, it is advised that the components be baked before SMT assembly, not only to eliminate their internal moisture but also to enhance their heat resistance. The BGA components should also be cooled for an average of half an hour after baking and before they enter the SMT assembly line.<h3>During Soldering</h3><img src="https://img.pcbx.com/dev/file/image/article/20240820/56e6c0c5468546a09df9b632dc959790.png" alt="during soldering-PCBX" data-href="" style="width: 100%;"/>The reflow soldering procedure is hard to control; thus, the optimal reflow temperature profile of the high performance of BGA components must be attained.Preheating ZoneDuring the preheating phase, the gradual temperature increase allows the activation of the flux. The temperature hike should be uniform to prevent deformation of the PCB as a result of rapid heating. The recommended elevation of temperature should be below 3 ℃/s, with 2 ℃/s being the best value, for some time, say 60-90 seconds.Thermal Soak ZoneThe flux starts to volatilize out in the thermal soak zone. The temperature should be kept between 150℃ and 180℃ for 60 to 120 seconds to make sure the flux is completely volatilized. The rate of temperature rise should generally be kept at 0.3 ~ 0.5℃/s.Reflow ZoneThe reflow zone is where the temperature goes up and crosses the melting point, and the solder paste liquefies. The temperature has to be more than 183℃ for 60 to 90 seconds. As this will affect the quality of the soldering, both too-short and too long periods must be avoided. Hence, the time in the temperature range 220±10℃ has to be exactly managed to stay within 10 to 20 seconds.Cooling ZoneThe solder paste begins to harden as it enters the cooling zone, securing components to the PCB. The temperature reduction must be such that it does not achieve extremely fast rates. Poor cooling can cause rapid temperature reduction on the PCB, reducing the quality of BGA soldering significantly.To ensure quality, it is possible to meet these standards by making sure that BGA components are soldered onto PCBs strictly. PCBX is a one-stop shop for PCB assembly, capable of handling BGA pitches as small as 0.35mm. Furthermore, the items go through rigorous inspections, such as AOI and AXI, which affects their performance and dependability.

Ensuring BGA soldering quality involves defect prevention, pre-soldering measures, and precise control during SMT assembly and reflow soldering.

How to Get BGA Perfectly Soldered on PCBs in SMT Assembly

As electronics becomes smaller, so did the space for components. BGA packaging emerged in the late 1980s, offering a solution. Compared to older options, BGA packs more connections in a smaller space, keeps costs similar, and avoids manufacturing hassles. Today, BGA is the go-to choice for high-connection chips like processors and storage.<h2>What is BGA?</h2>BGA is "Ball Grid Array," which refers to a PCB with a ball grid array structure, integrated circuit packaging method that uses an organic carrier. PCBs with BGA typically have smaller holes, with the finished holes under the BGA usually designed to have a diameter of 8-12 mil. The vias beneath the BGA must be plugged, and the pads should remain ink-free and undrilled.<img src="https://img.pcbx.com/dev/file/image/article/20240724/4984d4ca46ed489fa61c17e9975ad33e.PNG" alt="BGA" data-href="" style="width: 50%;"><h2>Design Guidelines for BGA Pads</h2><ol><li>The pad diameter is usually 20%-25% smaller than the solder ball diameter, which maximizes the routing space between the pads.</li><li>The pads on the BGA substrate and the PCB are the same diameter.</li><li>BGA pad design must ensure a stencil opening for 0.08mm³ of solder paste to ensure reliable solder joints.</li></ol><h2>Processes of BGA Packaging Technology</h2>The main process flow of BGA packaging includes solder ball production, substrate manufacturing, die attachment, encapsulation and curing, and packaging separation.<ol><li>Solder Ball Production: High-purity tin-lead alloy or lead-free materials produce solder balls, forming a regular ball grid array.</li><li>Substrate Manufacturing: Multi-layer printed circuit boards are used as substrates to achieve high-density, high-performance electrical interconnections.</li><li>Die Attach: The die is connected to the substrate and attached using lead-free or lead-based solder.</li><li>Encapsulation and Curing: The die is encapsulated with epoxy resin to protect it from environmental impacts.</li><li>Packaging Separation: The encapsulated chips are cut into individual BGA packages.</li></ol><img src="https://img.pcbx.com/dev/file/image/article/20240724/a846bb67550341a69c7623a9be9542c8.PNG" alt="Processes of BGA Packaging Technology" data-href="" style="width: 100%;"><h2>Types of BGA Packages</h2>BGAs, those tiny packages powering your devices, come in different flavors! Here's a quick guide:<ul><li style="text-align: left;">PBGA: Affordable, plastic-coated with etched copper traces. Ball pitch: 1.0 mm, 1.27 mm. 2-4 layered boards of organic matter.</li><li style="text-align: left;">FlipChip BGA: Flips the chip for better performance, using a hard, multilayered base.</li><li style="text-align: left;">CBGA: The tough guy - ceramic substrate for heat resistance in demanding applications.</li><li style="text-align: left;">CSPBGA (Cavity Down PBGA): PBGA with a tiny cavity for heat dissipation in compact devices.</li><li style="text-align: left;">TBGA (Tape BGA): Flexible, strip-shaped for space savings and movement.</li><li style="text-align: left;">H-PBGA (High-thermal BGA): Built for heat dissipation with special materials, ideal for high-power electronics.</li></ul><img src="https://img.pcbx.com/dev/file/image/article/20240724/0a4558e2732542e0947f9bff2f59bb1a.PNG" alt="BGA vs PGA vs LGA" data-href="" style="width: 100%;"><h2>Advantages and Disadvantages of BGA</h2><ul><li>Advantages</li></ul><ol><li style="text-align: left;">High Density: BGA packages offer larger pitch spacing, enabling a higher number of I/O pins to meet the demands of high-performance integrated circuits.</li><li style="text-align: left;">Superior Signal Transmission Performance: Due to the shorter connection paths of solder balls, BGA packages exhibit lower parasitic inductance and capacitance, facilitating high-speed signal transmission.</li><li style="text-align: left;">Excellent Thermal Performance: The solder balls in BGA packages effectively conduct heat, helping to reduce the working temperature of the chip.</li></ol><ul><li>Disadvantages</li></ul><ol><li style="text-align: left;">Demanding Manufacturing Processes: BGA packages require stringent soldering processes and equipment, adding to production costs.</li></ol>BGA packaging is a surface mount technology characterized by forming a regular array of spherical pins on the bottom of the package. This packaging method offers advantages such as larger pin pitch, good thermal performance, and excellent signal transmission capabilities, making it widely used in high-speed, high-performance integrated circuits. Its versatility and performance make it a technology of choice for a wide range of applications.

BGA uses solder balls at the bottom of the chip to connect it to the circuit board. It provides high density along with good heat dissipation and fast signal transmission, one of the main reasons it is ideal for modern electronics. However, it requires precise techniques of soldering in BGA manufacturing.

BGA - PCB Expert Manufacturing - PCBX

In the late 1980s, when electronics began to shrink, BGA packaging was developed to integrate more connections within a given area. Today, BGA is widely used with high-connection chips—processors being a good example.

BGA uses solder balls at the bottom of the chip to connect it to the circuit board. It provides high density along with good heat dissipation and fast signal transmission, one of the main reasons it is ideal for modern electronics. However, it requires precise techniques of soldering in BGA manufacturing.