Through-Hole Technology (THT) mounts electronic components by inserting their leads through pre-drilled PCB holes and soldering them. While durable and ideal for harsh conditions, THT is less space-efficient than SMT.

Pads and vias are crucial for PCB design: pads serve as soldering points for components, while vias connect different layers. Understanding and correctly implementing them ensures reliable, efficient, high-performance PCBs.

Printed Circuit Boards (PCBs) are crucial yet prone to corrosion, leading to malfunctions or failures. This article outlines detecting corrosion signs, preparing for cleaning, required materials, and step-by-step cleaning methods using isopropyl alcohol or alternatives. It also covers drying, reassembly, and preventive measures. Seek professional help if corrosion is severe.

Mixed Assembly PCBs combine Surface Mount Technology (SMT) and Through-Hole Technology (THT) for high-performance, compact, and reliable circuit boards. This integration leverages both technologies to enhance reliability, component selection, flexibility, and efficiency. Used in CPUs, IoT hardware, and more, they offer economic, efficient manufacturing for versatile applications in modern electronics.

Surface Mount Technology (SMT) revolutionized electronics, facilitating smaller, faster, and more reliable products. It mounts components directly on PCBs, enabling miniaturization and automation. Though SMT boosts space efficiency, cost-effectiveness, and reliability, it poses rework challenges and requires high initial investment.

IC packaging is essential in electronics for protecting components, providing electrical connections, and managing heat. This tutorial explores its complexities, including its importance, various types like SMD, QFP, and BGA, and considerations for choosing the right package for specific applications. Proper IC packaging enhances PCB performance and reliability.

Gold fingers are essential gold-plated edge connectors on PCBs, known for durability and conductivity, crucial for transmitting digital signals in electronics. They come in Electroplated Hard Gold and ENIG types. Used in motherboards, peripherals, and industrial machinery, they adhere to IPC standards ensuring reliable, high-quality connections in modern electronic devices.

Through-hole assembly is a key PCB manufacturing technique offering reliability and mechanical strength. This article details design elements, requirements, and standards, including thermal pads, IPC performance levels, component types, solder joint quality, hole sizes, and annular ring dimensions, ensuring robust and manufacturable PCBs for various applications.

Printed Circuit Board Assembly (PCBA) employs Through-Hole Technology (THT) and Surface Mount Technology (SMT). THT offers robust mechanical bonds, ideal for high-stress applications, whereas SMT supports efficient, high-density assemblies. Each method has unique advantages and limitations, impacting cost, manufacturing efficiency, and component compatibility. Understanding these differences is key for optimal PCB design.