Through-Hole Technology (THT) mounts electronic components by inserting their leads through pre-drilled PCB holes and soldering them. While durable and ideal for harsh conditions, THT is less space-efficient than SMT.

Mixed Assembly PCBs combine Surface Mount Technology (SMT) and Through-Hole Technology (THT) for high-performance, compact, and reliable circuit boards. This integration leverages both technologies to enhance reliability, component selection, flexibility, and efficiency. Used in CPUs, IoT hardware, and more, they offer economic, efficient manufacturing for versatile applications in modern electronics.

IC packaging is essential in electronics for protecting components, providing electrical connections, and managing heat. This tutorial explores its complexities, including its importance, various types like SMD, QFP, and BGA, and considerations for choosing the right package for specific applications. Proper IC packaging enhances PCB performance and reliability.

Through-hole assembly is a key PCB manufacturing technique offering reliability and mechanical strength. This article details design elements, requirements, and standards, including thermal pads, IPC performance levels, component types, solder joint quality, hole sizes, and annular ring dimensions, ensuring robust and manufacturable PCBs for various applications.

Printed Circuit Board Assembly (PCBA) employs Through-Hole Technology (THT) and Surface Mount Technology (SMT). THT offers robust mechanical bonds, ideal for high-stress applications, whereas SMT supports efficient, high-density assemblies. Each method has unique advantages and limitations, impacting cost, manufacturing efficiency, and component compatibility. Understanding these differences is key for optimal PCB design.

Wave soldering is a PCB assembly process that moves the board over a molten solder wave to create reliable connections. Evolving from dip and drag soldering, it offers consistent, high-quality solder joints. Despite its complexities, it remains essential for through-hole components and complex PCB assemblies.