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PCB Resources

Your comprehensive PCB knowledge resource. Explore in-depth guides on PCB design, material selection, fabrication techniques, and industry trends. Empower your PCB expertise today! 

PCB Resources - PCB Expert Manufacturing - PCBX

PCBA Resources

PCBX: Master the art of PCB assembly. Delve into expert guides on PCB assembly processes, techniques, and quality control procedures. Elevate your PCB assembly skills now! 

PCBA Resources - PCB Expert Manufacturing - PCBX

PCB Design

The PCB Design Resource Channel is a worthwhile location that provides electronic engineers and designers with top-notch resources and tools to design printed circuit boards. In this section, the latest guides in design, tutorial videos, software tools, example projects, and best practices are organized together for reference on how best to go about optimizing the design process for better work efficiency and product quality.

PCB Design - PCB Expert Manufacturing - PCBX

Copper is used for conducting routes on printed circuit boards (PCBs) because of its excellent electrical conductivity and strong physical characteristics. Unfortunately, copper is highly reactive and oxidizes quickly in air to form a thin solid oxide layer at the surface, which cause defects in the solder joints and hence reliability issues with the product, thereby reducing the life of a product. Therefore, protection from copper oxidation is essential. This requirement has brought about several surface coatings, which should withstand heat and be solderable. This article explains the functions, types, and principles of selection of surface coating on PCBs.<h2>What is PCB Surface Coating?</h2><h3 style="text-align: left;">Why PCB Surface Coating is Important？</h3>These surface finishes are applied to the copper pads of a PCB to prevent oxidation and contamination while retaining solderability. Copper is an excellent conductor and inexpensive; hence it is used as a conducting material for PCBs. Its high degree of reactivity means it easily forms an oxide layer, leading to defects in the solder joints and significantly reducing the reliability and shelf life of the product.Statistics indicate that about 70% of the defects in a PCB are due to solder joints, and there are two major reasons for this:Oxidization and Contamination: Oxidation and contamination of the pads on a printed circuit board will lead to incomplete soldering or cold solder joints.Diffusion and Inter-Metallic Compounds (IMCs): Diffusion between silver and copper, and the formation of IMCs between tin and copper at the interface, make it loose and brittle.Hence, a solderability or isolation protective layer on the copper surface is necessary to reduce or prevent these defects.<h3 style="text-align: left;">Requirements for PCB Surface Coatings</h3>The following are the characteristics desired of the surface coating on a PCB pad:Heat ResistanceThe coating needs to prevent the oxidation of the surface of the PCB pad during high-temperature soldering and enable solder reverse contact to take place with copper directly. The melting point of the coating should be close to or lower than that of solder, while its thermal decomposition temperature is much higher.CoverageThe coating shall provide good coverage of the copper pad surface such that no oxidation or contamination at all may occur before and during soldering. It should also not drift, decompose, or float on the solder joints and represent all solder adhesion onto the pad.ResidueThe residue left on either the pad or solder joints after soldering should be kept as minimal and easily removable to prevent any potential kind of hazard.CorrosivityThe coating should not cause corrosion of the substrate or metallic layers of the PCB during the post-soldering process.Environmental ConsiderationsEnvironmental consideration is gaining much importance. The effluents generated during application and related cleaning processes should have easy handling and be ecologically friendly.<h2>Types of PCB Surface Coatings</h2><h3 style="text-align: left;">Based on Manufacturing Technology</h3>The PCB surface finishes depend on their manufacturing processes, and according to this, including:Surface CoatingPhysically adds a thin, heat-resistant, and solderable coating to the copper surface. Examples include HASL and OSP.<table style="width: auto;"><tbody><tr><th colSpan="1" rowSpan="1" width="auto"><img src="https://img.pcbx.com/dev/file/image/article/20240821/7b473552805c484084887d43aa7a61ea.png" alt="HASL-PCBX" data-href="" style=""/></th><th colSpan="1" rowSpan="1" width="auto"><img src="https://img.pcbx.com/dev/file/image/article/20240821/7ea3f34eec5845498f49956d877190c4.png" alt="OSP Finish-PCBX" data-href="" style=""/></th></tr></tbody></table>Metal CoatingConsists of electroless plating and electroplating to create a metal coating over the copper pad, which is heat-resistant and solderable. Examples include ENIG and ENEPIG.<img src="https://img.pcbx.com/dev/file/image/article/20240821/c603e1ca99cd445e99fcf6dbbf61b4cf.png" alt="ENIG and ENEPIG-PCBX" data-href="" style="width: 100%;"/><h3 style="text-align: left;">Based on Application Effects</h3>According to their application effects, the surface finishes can be divided into three categories as follows:Soldering flux on the coating of the isolating layerAllows the solder to float on the surface under high-temperature soldering; however, IMCs can form at the interface, increasing defect risks.Soldering flux on the metal coating of the diffusion layerDesigned to eliminate IMCs but can cause diffusion and brittleness, which may result in defects in circuits.Soldering flux on the isolating layer of the metal coatingAvoid the contact of solder with copper and hence it will not form any IMC or normally diffuse the metal, thus providing an increase in reliability to the part.<h2>Choosing the Correct Type of PCB Surface Coating</h2>This PCB surface coating selection may have an impact on solderability, reliability, and shelf life. The decision is based on the application and its requirements.<h3>For a General Application</h3>Coatings like HASL or OSP, which allow soldering flux to adhere without an isolating layer, are appropriate for use in consumer electronics and industrial devices.<h3>For High-Reliability Applications</h3>In high-reliability and long shelf life applications, it is recommended to use surface coatings in which the soldering flux adheres to an isolating layer itself, like ENIG or ENEPIG, in fields of medical devices, transportation, military, and aerospace.Knowing the importance, types, and selection criteria for PCB surface coatings will significantly improve the quality and reliability of products in a variety of industries.

Copper in PCBs oxidizes, causing solder defects and reducing product life. Surface coatings like HASL, OSP, ENIG, and ENEPIG prevent this, ensuring solderability and reliability. Choosing the right coating based on application needs significantly improves the quality, reliability, and lifespan of products.

PCB Surface Coating Functions and Selection Principles

While designing or ordering a printed circuit board, have you wondered if the silkscreen layer was really necessary, and if so, at what extra cost? Let's see what a silkscreen is and why it's important in PCB manufacturing.<h4>What is Silkscreen?</h4>Applied on the PCB for identification purposes is the silkscreen, otherwise known as the layer of non-conductive ink: components, test points, parts, warning symbols, logos, and other markings. Normally, this should be applied to the component side, but sometimes this is placed on the solder side of the board. A more detailed silkscreen will help the manufacturer and the engineer locate where all the components of a PCB will be placed.This layer uses epoxy ink, normally black, white, or yellow, and most PCB software uses standard fonts for these markings. Conventionally, silk-screening would require the following tools: a polyester screen stretched on aluminum frames, a laser photo plotter, a spray developer, and curing ovens.The silkscreen layer can include important information, such as:<ul><li style="text-align: left;">Polarities of parts</li><li style="text-align: left;">Location of parts through reference designators</li><li style="text-align: left;">Test points</li><li style="text-align: left;">Unique identification numbers for each board</li><li style="text-align: left;">Warning symbols.</li></ul><img src="https://img.pcbx.com/dev/file/image/article/20240821/18578b066b4a42f287f748ac39474b28.png" alt="pcb silkscreen-PCBX" data-href="" style="width: 100%;"><h4>The Importance of Silkscreen in PCB Assembly</h4>In the past few years, silkscreen applications have undergone a shift from the use of stencils to direct application methods. Currently, there exist two major methods which are applied in the printing of silkscreen on a PCB. These are liquid photo imaging and direct legend print.<ul><li style="text-align: left;">Liquid Photo Imaging (LPI): Using line widths greater than 4 mil, liquid photo-imageable epoxy is coated onto the laminate and exposed with UV light, then developed and cured on the board, providing increased accuracy compared to manual screening.</li><li style="text-align: left;">Direct Legend Printing (DLP): This offers the highest accuracy at a higher cost. The inkjet projector sprays acrylic ink onto the raw PCB guided by CAD data, and UV light cures the ink as it comes out from the printer. Note that acrylic ink does not cure well on boards finished with silver.</li></ul>While silkscreen application happens during fabrication, it is extremely important for assembly, which involves component placement or mounting. Some key silkscreen markings that facilitate proper placement include:<ul><li style="text-align: left;">Reference Indicators: Explains what kind of components are from the BOM.</li><li style="text-align: left;">Pin 1 Indicators: Shows which pins connect to what pads of the footprint.</li><li style="text-align: left;">Component Outlines: Combined with the landing pattern, these indicate where the components should be placed.</li><li style="text-align: left;">Polarity Indicators: Indicate the orientation of polarized components.</li></ul>For parts with few pads or simple shapes, omission of the component outline for general placement may be acceptable. It will then create asymmetrical placement issues, such as tombstoning, in soldering. The absence of reference, Pin 1, and polarity indicators can make a component be oriented or placed incorrectly. This would then lead to poor device functionality.&lt;button class="center btn-lg" data-href="/order/manufacturing/pcba"&gt;Get an Instant Quote for PCB Assembly&lt;/button&gt;<h4>PCBX's expertise in silkscreen</h4>PCBX has become one of the most experienced manufacturers for PCBs and PCB assembly in China, having been an industry leader for almost two decades. PCBX specializes in quick-turn PCB prototypes and assembly, as well as medium and small volume PCB manufacturing, and strives to satisfy all of your silkscreen requirements with high quality and precision on every project. Cooperating with PCBX will provide you access to our expertise and dedication to superior silkscreen application on your PCBs.

The silkscreen layer, made of non-conductive ink, is vital for identifying PCB components and ensuring accurate placement. Methods like Liquid Photo Imaging and Direct Legend Print enhance precision. PCBX excels in producing high-quality silkscreen applications, crucial for proper assembly and functionality.

PCB Silkscreen

PCB Surface Finishes Introduction and Comparison

While ordering PCBs, one needs to decide upon the substrate material of the PCB, solder mask, silkscreen, surface finish, size and thickness of the board, the thickness of copper, blind and buried vias, through-hole plating, SMT, panels, tolerances, and any other specifications before your circuit boards are fabricated. Of these factors, the choice of surface finish is most important due to its large effect on the reliability of an electronic product. Since the copper layers on the PCBs are easily oxidized, this oxidation can seriously degrade soldering quality and hence the reliability or functionality of final products. The surface finish prevents the pads from oxidation, ensuring good solderability for electrical performance.Surface finish, known as surface coating, is an important process between PCB manufacturing and circuit board assembly, offering dual functions in its processes: first the protection of exposed copper circuitry, and second solderability for component attachment. As seen in Figure 1, the surface finish is applied onto the outermost layer of the PCB on top of the copper, which functions like a protective "coat" for the copper.<img src="https://img.pcbx.com/dev/file/image/article/20240807/9bf3a4435f304628b1d5e5966e338521.png" alt="Surface Finish on PCB-PCBX" data-href="" style="width: 50%;"><h2>Types of surface finish</h2>There are mainly two big categories for surface finishes of a PCB: metallic and organic. Metallic finishes include HASL, ENIG/ENEPIG, Immersion Gold, and Immersion Tin, while OSP and Carbon Ink are under organic finishes.<h3>HASL Hot Air Solder Leveling</h3>HASL is the conventional surface finish, which is always applied to PCBs. In this process, the board is submerged in a bath of molten solder; this flow completely covers all the exposed copper surfaces with solder. This excess solder is removed by passing the board through hot air knives as shown in Figure 2 below：<img src="https://img.pcbx.com/dev/file/image/article/20240807/d39bec69331e4dff91741dbbf3df5db5.png" alt="HASL Process-PCBX" data-href="" style="width: 100%;"/><table style="width: auto;"><tbody><tr><td colspan="1" rowspan="1" width="auto" style="text-align: center;">Pros of HASL Surface Finish</td><td colspan="1" rowspan="1" width="auto" style="text-align: center;">Cons of HASL Surface Finish</td></tr><tr><td colspan="1" rowspan="1" width="auto" style="text-align: left;">• Excellent wetting during component soldering; • Copper corrosion avoided;</td><td colspan="1" rowspan="1" width="auto" style="text-align: left;">• Low planarity on vertical levelers leads HASL unacceptable for fine pitch components; • High thermal stress during process causes defects into circuit board; </td></tr></tbody></table>On account of concern for the protection of the environment, HASL itself has evolved into two variants: lead-based HASL and lead-free HASL. The lead-free version is compliant with RoHS regulations, first put in place by the EU.<h3>ENIG and ENEPIG</h3>ENIG is an abbreviation for Electroless Nickel Immersion Gold. A coating of electroless nickel is put on the PCB, followed by a small layer of immersion gold to keep the nickel from oxidizing. ENEPIG stands for Electroless Nickel Electroless Palladium Immersion Gold, which means that in addition to what ENIG does, a palladium layer will be added to act as a barrier, preventing nickel from oxidizing and diffusing into the copper layer. While ENIG and ENEPIG provide far improved solderability to the other surface treatments, their prices are significantly higher. The varied processes for creating ENIG versus ENEPIG are diagrammed below in Figure 3:<img src="https://img.pcbx.com/dev/file/image/article/20240807/760e7b88166040c9b4bab1769f243253.png" alt="manufacturing process of ENIG and ENEPIG-PCBX" data-href="" style="width: 100%;"/>The electroless nickel step is autocatalytic, a deposition of nickel onto the palladium-catalyzed copper surface. The reducing solution contains nickel ions, which must be maintained in specified concentrations, temperatures, and acid levels. During the Immersion Gold step, the gold adheres to the nickel-plated areas through molecular exchange and covers the nickel, protecting it until soldering, and control of the gold thickness within specified tolerances ensures the continued solderability of the nickel.Both ENIG and ENEPIG have their pros and cons. On its part, ENIG has potential advantages from the fact that it has a flat surface to its fast application and high-temperature resistance. On the other side, ENEPIG brags of strength in withstanding reflow cycles and truly reliable wire bonding. Depending on the application imperatives, each finish has its chastened uses. ENIG is mainly geared toward lead-free soldering, SMT, and BGA packages. Oppositely, ENEPIG is applicable for rigorous processes like THT, SMT, BGA, wire bonding, and press-fit technologies.<h3>ImAg (Immersion Silver)</h3>ImAg consists of a thin layer of immersion silver plating over copper traces. The standard procedure for making ImAg is as follows:<img src="https://img.pcbx.com/dev/file/image/article/20240807/3b3e503018c740b8896500c4053bb0b9.png" alt="ImAg Process-PCBX" data-href="" style="width: 100%;"/> <table style="width: auto;"><tbody><tr><td colspan="1" rowspan="1" width="auto" style="text-align: center;">Pros of ImAg Surface Finish</td><td colspan="1" rowspan="1" width="auto" style="text-align: center;">Cons of ImAg Surface Finish</td></tr><tr><td colspan="1" rowspan="1" width="auto" style="text-align: left;">• Planar surface; • Short, easy process cycle; • Inexpensive; • High conductivity; • Good for fine pitch product; • Copper/Tin solder joint; • Reworkable; • Not affect hole size ;</td><td colspan="1" rowspan="1" width="auto" style="text-align: left;">• Tarnish ; • Silver migration; • Planar micro voids; • Creep corrosion; ImAg offers a superior surface polish for soldering and testing. However, the main disadvantage is that it is prone to creep corrosion.</td></tr></tbody></table><h3>ImSn—Immersion Tin</h3>ImSn uses tin instead of silver, and one of the main advantages of this process is the very planar finish that it provides to the copper pads, which in turn makes it highly suitable for SMT applications. Another fast became the fact that ImSn offers a surface easily detectable by common AOI techniques used.<h3>OSP: Organic Solderability Preservatives</h3>OSP belongs to the surface finishes using transparent organic material. The water-based organic compound can attach itself selectively onto copper, thus protecting it until soldering. The process of a typical OSP is as follows:<img src="https://img.pcbx.com/dev/file/image/article/20240807/1348b51938374546b4d879daff79873a.png" alt="OSP Process-PCBX" data-href="" style="width: 100%;"/> <table style="width: auto;"><tbody><tr><td colspan="1" rowspan="1" width="291.51" style="text-align: center;">Pros of OSP Surface Finish</td><td colspan="1" rowspan="1" width="297.34" style="text-align: center;">Cons of OSP Surface Finish</td></tr><tr><td colspan="1" rowspan="1" width="auto" style="text-align: left;">• Flat/planar; • Short, easy process cycle ; • Inexpensive; • Reworkable ; • Not affect finished hole size; • Copper/Tin solder joint;</td><td colspan="1" rowspan="1" width="auto" style="text-align: left;">• Multiple reflows ; • Limited shelf life ; • Not conductive ; • Difficult to inspect; • Limited thermal cycles ;</td></tr></tbody></table><h3>Summary</h3>Each type of surface finish has different advantages and disadvantages. Selection should consider end-use application, performance requirements, cost, corrosion resistance, ICT capabilities, hole fill, and other applicable parameters. The more variables used to compare, the more accurate your selection will be.Comparing Surface Finishes<ul><li style="text-align: left;">Cost: ImAg and OSP are the least expensive, with ENIG as the highest cost option.</li><li style="text-align: left;">Corrosion Resistance: HASL and ImSn are at the top; ImAg is last on the list.</li><li style="text-align: left;">ICT Capability: Essentially, all finishes are good, except OSP.</li><li style="text-align: left;">Hole Fill: HASL and ENIG are excellent compared to other finishes.</li></ul><h2>Surface Finish Selection</h2>Choosing an appropriate surface finish in the fabrication of printed circuit boards is very important for high process yields, low numbers of rework, low field failure rates, effective test capabilities, low scrap rates, and a lower cost. All significant factors related to assembly should be taken into consideration to ensure the final products are of a quality standard and performed accordingly.Each occupant has different selection criteria. More often than not, the chosen surface finish meets particular requirements and convenience at the cost of quality, performance, and reliability of the PCB.In light of the above descriptions of each type of surface finish, some attributes become very critical selection criteria. As one can tell from the form shown below, each of the types of surface finishes either has it or otherwise, giving a guideline for selecting the best option for the surface finish, considering the requirements and characteristics of your PCB products.<table style="width: auto;"><tbody><tr><td colspan="1" rowspan="1" width="auto" style="text-align: center;">Items</td><td colspan="1" rowspan="1" width="auto" style="text-align: center;">HASL</td><td colspan="1" rowspan="1" width="auto" style="text-align: center;">ENIG</td><td colspan="1" rowspan="1" width="auto" style="text-align: center;">ENEPIG</td><td colspan="1" rowspan="1" width="auto" style="text-align: center;">ImAg</td><td colspan="1" rowspan="1" width="auto" style="text-align: center;">ImSn</td><td colspan="1" rowspan="1" width="auto" style="text-align: center;">OSP</td></tr><tr><td colspan="1" rowspan="1" width="auto" style="text-align: left;">Cost sensitive product</td><td colspan="1" rowspan="1" width="auto" style="text-align: left;">√</td><td colspan="1" rowspan="1" width="auto" style="text-align: left;">x</td><td colspan="1" rowspan="1" width="auto" style="text-align: left;">x</td><td colspan="1" rowspan="1" width="auto" style="text-align: left;">√</td><td colspan="1" rowspan="1" width="auto" style="text-align: left;">√</td><td colspan="1" rowspan="1" width="auto" style="text-align: left;">√</td></tr><tr><td colspan="1" rowspan="1" width="auto" style="text-align: left;">High volume required</td><td colspan="1" rowspan="1" width="auto" style="text-align: left;">x</td><td colspan="1" rowspan="1" width="auto" style="text-align: left;">x</td><td colspan="1" rowspan="1" width="auto" style="text-align: left;">x</td><td colspan="1" rowspan="1" width="auto" style="text-align: left;">√</td><td colspan="1" rowspan="1" width="auto" style="text-align: left;">√</td><td colspan="1" rowspan="1" width="auto" style="text-align: left;">√</td></tr><tr><td colspan="1" rowspan="1" width="auto" style="text-align: left;">Cosmetics of surface finish</td><td colspan="1" rowspan="1" width="auto" style="text-align: left;">√</td><td colspan="1" rowspan="1" width="auto" style="text-align: left;">x</td><td colspan="1" rowspan="1" width="auto" style="text-align: left;">√</td><td colspan="1" rowspan="1" width="auto" style="text-align: left;">x</td><td colspan="1" rowspan="1" width="auto" style="text-align: left;">√</td><td colspan="1" rowspan="1" width="auto" style="text-align: left;">√</td></tr><tr><td colspan="1" rowspan="1" width="auto" style="text-align: left;">Lead-free wave solder</td><td colspan="1" rowspan="1" width="auto" style="text-align: left;">√</td><td colspan="1" rowspan="1" width="auto" style="text-align: left;">√</td><td colspan="1" rowspan="1" width="auto" style="text-align: left;">√</td><td colspan="1" rowspan="1" width="auto" style="text-align: left;">√</td><td colspan="1" rowspan="1" width="auto" style="text-align: left;">x</td><td colspan="1" rowspan="1" width="auto" style="text-align: left;">x</td></tr><tr><td colspan="1" rowspan="1" width="auto" style="text-align: left;">Fine pitch components used</td><td colspan="1" rowspan="1" width="auto" style="text-align: left;">x</td><td colspan="1" rowspan="1" width="auto" style="text-align: left;">√</td><td colspan="1" rowspan="1" width="auto" style="text-align: left;">√</td><td colspan="1" rowspan="1" width="auto" style="text-align: left;">√</td><td colspan="1" rowspan="1" width="auto" style="text-align: left;">√</td><td colspan="1" rowspan="1" width="auto" style="text-align: left;">√</td></tr><tr><td colspan="1" rowspan="1" width="auto" style="text-align: left;">Requirement of wire bonding to surface finish</td><td colspan="1" rowspan="1" width="auto" style="text-align: left;">x</td><td colspan="1" rowspan="1" width="auto" style="text-align: left;">√</td><td colspan="1" rowspan="1" width="auto" style="text-align: left;">√</td><td colspan="1" rowspan="1" width="auto" style="text-align: left;">√</td><td colspan="1" rowspan="1" width="auto" style="text-align: left;">x</td><td colspan="1" rowspan="1" width="auto" style="text-align: left;">x</td></tr><tr><td colspan="1" rowspan="1" width="auto" style="text-align: left;">High yield ICT</td><td colspan="1" rowspan="1" width="auto" style="text-align: left;">√</td><td colspan="1" rowspan="1" width="auto" style="text-align: left;">√</td><td colspan="1" rowspan="1" width="auto" style="text-align: left;">√</td><td colspan="1" rowspan="1" width="auto" style="text-align: left;">√</td><td colspan="1" rowspan="1" width="auto" style="text-align: left;">√</td><td colspan="1" rowspan="1" width="auto" style="text-align: left;">x</td></tr><tr><td colspan="1" rowspan="1" width="auto" style="text-align: left;">Lead-free shock/drop</td><td colspan="1" rowspan="1" width="auto" style="text-align: left;">√</td><td colspan="1" rowspan="1" width="auto" style="text-align: left;">x</td><td colspan="1" rowspan="1" width="auto" style="text-align: left;">x</td><td colspan="1" rowspan="1" width="auto" style="text-align: left;">√</td><td colspan="1" rowspan="1" width="auto" style="text-align: left;">√</td><td colspan="1" rowspan="1" width="auto" style="text-align: left;">√</td></tr><tr><td colspan="1" rowspan="1" width="auto" style="text-align: left;">Possibilities of corrosion failure</td><td colspan="1" rowspan="1" width="auto" style="text-align: left;">√</td><td colspan="1" rowspan="1" width="auto" style="text-align: left;">√</td><td colspan="1" rowspan="1" width="auto" style="text-align: left;">√</td><td colspan="1" rowspan="1" width="auto" style="text-align: left;">x</td><td colspan="1" rowspan="1" width="auto" style="text-align: left;">√</td><td colspan="1" rowspan="1" width="auto" style="text-align: left;">√ </td></tr></tbody></table>The ultimate in surface-finish selection should be to provide the optimal balance of the many functions. Each surface finish has its own list of pros and cons. Fortunately, there are techniques in engineering to help offset the negatives. Some examples are, to overcome the reduced wetting force of OSP, consider one or more of the following: improve the board solderability plating, alter wave solder alloys, or increase top-side preheat. It is all about taking every possible consideration to reach an optimum performance.The growing importance of environmental issues in the electronics industry has prompted different regulations recently, including RoHS, or the Restriction of Hazardous Substances and Lead-Free, gaining its first appearance within the European Union through Directive 2002/95/EC. This directive bans the use of six hazardous chemicals in electrical and electronic equipment, and beginning July 1, 2006, all eligible products supplied in the EU market must be RoHS-compliant. RoHS compliance has a broad impact on the electronics industry, driving demand for lead-free surface treatments.&lt;button class="center btn-lg" data-href="/order/manufacturing/pcb"&gt;Check Prices with Different Surface FInish&lt;/button&gt;PCBX provides a convenient and free online price calculator to help you estimate the cost of PCBs with any of the following surface finishes. Click the button below to access the PCB quote page and see how prices vary with different surface finish options.

Selecting the right PCB surface finish, from options like HASL, ENIG, ENEPIG, and OSP, is crucial for preventing oxidation, ensuring solderability, and meeting reliability standards.