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Your comprehensive PCB knowledge resource. Explore in-depth guides on PCB design, material selection, fabrication techniques, and industry trends. Empower your PCB expertise today! 

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PCBA Resources

PCBX: Master the art of PCB assembly. Delve into expert guides on PCB assembly processes, techniques, and quality control procedures. Elevate your PCB assembly skills now! 

PCBA Resources - PCB Expert Manufacturing - PCBX

PCB Design

The PCB Design Resource Channel is a worthwhile location that provides electronic engineers and designers with top-notch resources and tools to design printed circuit boards. In this section, the latest guides in design, tutorial videos, software tools, example projects, and best practices are organized together for reference on how best to go about optimizing the design process for better work efficiency and product quality.

PCB Design - PCB Expert Manufacturing - PCBX

Printed circuit boards are the unsung heroes of modern electronics, hidden under the hood of every gadget, from a smartphone to a satellite. At the heart of designing and fabricating a printed circuit board is the choice of its thickness, which affects the performance, durability, and cost of the board. While there isn't an absolute industry standard for the thickness of a PCB, there are some baseline measurements preferred and in use today due to historical and functional advantages associated with their application. This article explores what determines the thickness of a PCB, how the thickness affects both performance and manufacturing, and what considerations go into deciding whether to use a non-standard custom thickness.<h2>Common PCB Thicknesses</h2>The most widely accepted standard of PCB thickness is 1.57 mm (0.062 inches). This size dates back to the early days of PCB fabrication where Bakelite sheets were made at this thickness. Over the years, this dimension has remained predominant due to the evolution of manufacturing processes and equipment calibrated to this size.Other common thicknesses apart from the standard 1.57 mm have only recently gained popularity in order to accommodate specific applications:0.024 inches (0.6 mm; used in ultra-thin PCBs)0.031 inches (0.78 mm)0.047 inches (1.2 mm)0.093 inches (2.36 mm; used for heavy-duty applications)<img src="https://img.pcbx.com/dev/file/image/article/20240910/871c6319b5094d27b314fc1f939e3d4d.png" alt="" data-href="" style="width: 100%;"/><h2>Measuring the Thickness of a PCB</h2>There is quite some precision required in measuring the thickness of a PCB, employing various tools like a micrometer, calipers, and, for higher accuracy, non-contact methods that include laser micrometers and optical profilers. All these tools are essential in verifying whether the manufactured PCBs meet the specifications in the design.<h2>Factors That Affect the Thickness of a Printed Circuit Board</h2>There are various design and manufacturing factors that determine a suitable thickness for a PCB.<h3>Copper Thickness</h3>Copper thickness is always expressed in ounces per square foot and plays a very important role in the current-carrying capacity and thermal performance of the board. The common ranges of copper thickness vary from 1 to 2 oz, which in turn affects the overall thickness of the PCB and also the complexity in manufacturing. Higher copper content requires thicker boards capable of handling increased thermal dissipation and current loads.<h3>Material Choice</h3>The substrate and laminate materials also drive PCB thickness. Typical substrates include epoxy resin, glass weave, or ceramic, while laminates consist of thermoset resin. With distinct thermal, mechanical, and electrical properties, each material impacts the overall integrity and functionality of the board.<h3>Number of Layers</h3>The more the number of layers on a PCB, the thicker it is. A standard 1.57 mm thick PCB can have 2 to 6 layers easily. However, in multi-layer boards, sometimes the number of layers goes beyond 60, and each extra layer adds to the thickness considerably. Decreasing the number of layers is sometimes not a feasible option, especially in complicated designs, and this brings extra thickness.<h3>Size, Weight, and Flexibility</h3>The eventual application of the PCB greatly impacts the thickness requirements. The rigid ones require larger profiles to enhance durability, and the flexible ones should be thin enough to ensure they retain their flexibility, which is a crucial factor in their existence. The right balance between rigidity and flexibility is of essence in the decision on either one. It is based on the environmental working condition the board is exposed to.<h3>Environmental Conditions</h3>Under harsh environmental conditions, like high temperatures or mechanical stress, the thicker PCBs are more resistant. However, thinner PCBs are used for reducing weight in compact or portable devices.<h2>Impact on Manufacturing</h2>The choice of the PCB thickness does not only influence the electrical and mechanical features of the board, but it also impacts several aspects of manufacturing:<h3>Drill Hole Equipment</h3>Thicker PCBs need more advanced drilling equipment since it can sustain precision, and the hole diameters below become difficult with increasing thickness.<h3>Copper Etching</h3>A thicker copper layer complicates the manufacturing processes like etching, thus making the manufacture costlier and the production more challenging.<h3>Depanelization Method</h3>The method of depanelizing individual PCBs from the panel depends on the thickness. Thick boards are usually V-scored because they are rigid, but thinner boards may use breakaway tabs.<img src="https://img.pcbx.com/dev/file/image/article/20240910/fa5254aca9784062a357f2280377b134.jpg" alt="Custom PCB Thickness-PCBX" data-href="" style="width: 100%;"/><h2>Custom PCB Thickness</h2>While a standard thickness works most of the time with almost all modern manufacturing processes, certain applications mandate the use of custom thicknesses like:High-Power Applications: These use thicker boards that can handle current and deal with heat generation.Space-Constrained Devices: This would be the case with smartphones, where a thinner PCB might realize a notable design advantage.High-Frequency Applications: In such applications, thinner boards lower signal loss, improving performance.Rugged Environments: In such applications, extra mechanical ruggedness and durability are needed.There are various factors that must be considered in choosing custom thickness:Manufacturing Capabilities: This is to establish the limitations of available equipment at the manufacturer and their process capability.Turnaround Time: Custom thicknesses may prolong production time while the manufacturing processes get adjusted.Added Expenses: Special thicknesses normally cost more because of specially required materials and longer production time.<h2>PCBX: Your Best Partner in Diverse PCB</h2>PCB Thickness: PCBX offers a variety of PCB thickness options well beyond standard options, so you get all the functionality you may need in one for your unique application. Standard choices, while faster and more cost-effective to manufacture, can turn into custom thicknesses to make sure it fits your application to a T.At PCBX, we strive to give our customers the best PCBs every time. Whether it is the type or volume of printed circuit boards you wish to order, customer service and expert engineering are the cornerstones of our business that ensure our products are well-made and competitively priced.With PCB manufacturing facilities in both the domestic and international markets, PCBX has served customers worldwide. Feel free to contact us if you are interested in tapping into what we can do, or have questions about discussing various PCB thickness options.

PCB thickness is crucial in electronics, influencing performance, durability, and cost. The standard thickness is 1.57mm, but other sizes exist for specific needs. Factors like copper thickness, material choice, layers, and environmental conditions determine suitability. Custom thicknesses cater to high-power, space-limited, and high-frequency applications but may increase cost and production time. PCBX offers various thickness options, emphasizing quality and customer service in PCB manufacturing.

Standard Thickness of PCB

The process of creating a printed circuit board is complicated and involves various detailed files for production. These files give critical information regarding the design of the PCB, its components, layers, and specifications. The maximization of the documentation in an effort to avoid any potential errors is very instrumental in making the manufacturing process easy. In the article, we describe the main files necessary for the manufacture of a PCB and explain what's important about them.<h2>Gerber Files</h2><img src="https://img.pcbx.com/dev/file/image/article/20240828/06c58b2056f14901a2803fc4a1e15f8e.png" alt="Gerber Files-PCBX" data-href="" style="width: 100%;"/>Gerber files are the standard for PCB manufacturing, describing individual layers of the PCB in a graphical format that manufacturers use to fabricate the board. Each layer of the PCB design gets converted into a separate Gerber file.<ul><li>Copper Layers: Top and bottom copper traces; internal layers on multilayer boards that define the electrical connections of your PCB.</li><li>Solder Mask Layers: These layers for top and bottom outline areas that should either have solder mask applied to, or from.</li><li>Silkscreen Layers: Component labels, logos, and any other markings on both the top and bottom of the PCB.</li><li>Paste Layers: These are required for SMD—Surface Mount Device Assembly. They specify the areas where solder paste should be applied.</li><li>Board Outline: It describes the dimensions, shape, and physical form of the PCB.</li></ul><h3>NC Drill File</h3>The NC (Numerical Control) Drill file contains information on all the holes to be drilled into the PCB. These can include vias, through-hole component leads, and mounting holes.Contents:Hole positionsHole sizesHole typesPlated or Non-plated<h3>Bill of Materials (BOM)</h3><img src="https://img.pcbx.com/dev/file/image/article/20240823/7a05094e84724034926d4627aa1b9b65.png" alt="BOM-PCBX" data-href="" style="width: 100%;">BOM-PCBXThe BOM includes a detailed list of all components used to build the PCB, including:Component reference designators (e.g. R1, C2)Part numbersComponent descriptionsQuantitiesManufacturer or supplier details<h3>Centroid File</h3>The Pick and Place file or Centroid file, contains all of the SMD's positions and orientations on the PCB.contents:X and Y coordinates of each componentrotation anglesReference designatorsLayer information, top or bottom<h3>Readme or Assembly Drawing</h3>Though not required, it is very helpful to include a Readme file or an Assembly Drawing. These can contain details such as:Board stack-upSpecial instructions or notesComponent placement detailsLayer descriptions<img src="https://img.pcbx.com/dev/file/image/article/20240828/e7360ba5b0874f22841ea79fadde46db.png" alt="Drawing-PCBX" data-href="" style="width: 100%;"/><h3>Dimension Drawing</h3>The Dimension Drawing ensures that the PCB will physically fit within its intended enclosure or application, ensuring that there are no mechanical fit issues. Details include mechanical dimensions of the PCB containing:<ul><li>Outline of the board</li><li>Position and size of holes</li><li>Any cutouts or slots</li></ul><h3>Conclusion</h3>A full set of files for PCB fabrication ensures the accuracy and quality of manufactured boards. Gerber files, NC Drill files, BOMs, Centroid files, Readme or Assembly Drawings, and Dimension Drawings all provide specific design information in the process of communicating with the manufacturer. This could be done by making sure there is careful preparation of these documents and that the guidelines of the manufacturers are followed. It greatly lessens the possibility of error in the PCB fabrication process.

Creating a PCB involves detailed files like Gerber, NC Drill, BOM, Centroid, Readme, and Dimension Drawings. These files ensure precise design communication and minimize manufacturing errors.

Essential Files for PCB Fabrication

Difficulties for Backplane PCB Fabrication

A backplane printed circuit board, for most laymen, is simply a baseboard to connect the other functional boards, and able to host any one of its daughterboards or even line cards. Besides subboard accommodation, it is mainly for distribution of power to the functional boards and the loading of electrical connections and signals. Consequently, there is a symbiotic relationship: the functionality of the system is achieved by both the backplane and the subboards.Backplane boards now serve more purposes than just supporting functional boards; they also transmit signals and distribute power as IC products become more complex, have more I/O, and are capable of high-frequency signals and high-speed digitizing due to advancements in electronics assembly. Under this circumstance, backplane boards are required to having more layers to cater to all these functions. There will be strict requirements for the layer counts, which can vary from 20 to 60 layers, board thickness from 4 mm to 12 mm, via count from 30,000 to 100,000, and also reliability, frequency, and quality in transmitting signals.To achieve the above performance requirements, backplane PCB fabrication needs to overcome the incredible challenges, involving board thickness, board size, layer count, alignment control, back drilling depth, and stub management. This article tries to give a detailed introduction on core problems during the backplane PCB fabrication process and how to deal with them from over a decade's experience in fabrication at PCBX.<h3>Alignment Control</h3>Alignment control is one of the main problems in the creation of ultra-multi-layer PCBs because misalignment usually causes shorts. However, there are a lot of processes and problems that affect alignment control, with layer stack-up being the most important. Three general types of stack-up in multi-layer PCB are: mass-lam, pin-lam, and heating thermocouple.<img src="https://img.pcbx.com/dev/file/image/article/20240821/9480287eabb84ad987ee039df81c930e.png" alt="Alignment Control-PCBX" data-href="" style="width: 100%;"/>Tips:<ul><li style="text-align: left;">That is because it seldom creates a shock effect on the core board.</li><li style="text-align: left;">In cases where pin-lam is simply not a possibility, copper-iron rivets along with small dowels can be used.</li><li>In the pin-lam stack-up, the type of pins should be carefully selected based on their binding abilities. In several samples, four pins performed better than eight circular pins, even though some alignment controls were required in some studies.</li></ul><h3>Drilling Technology</h3>A backplane board is relatively thick, and hence, it is difficult to drill. Short tools are not long enough for the hole to pass through the board, and long tools are too thin and can be very easily broken while drilling; at the same time, large quantities of dust may block the hole so that the tool itself breaks. During this period, burrs might form at the hole, which will seriously affect the performance of the backplane PCB.Tips:<ul><li style="text-align: left;">The CCD method is used in drilling backplane boards. The CCD markers are determined by the holes already drilled using X-ray drilling.</li><li style="text-align: left;">Conductive depth control methods can accurately control the drilling depth.</li></ul><h3>Electroplating Capability</h3>Due to the high thickness of backplane boards, the aspect ratio is typically large. Thus, there will be a need to ensure the presence of an adequate amount of copper deposited inside the holes. If not enough, it may lead to an uneven distribution of copper in the hole and will affect the via apertures and hole wall copper thickness compatibility.Tips:<ul><li style="text-align: left;">Compare plating solutions between pulse plating and DC plating in order to find out the plating capability, reliability of the deposit, and solution stability.</li><li style="text-align: left;">Use advanced DC plating solutions, such as EP.</li></ul><img src="https://img.pcbx.com/dev/file/image/article/20240821/48379241780a41299673b51c512aeb12.jpg" alt="backplane pcb-PCBX" data-href="" style="width: 100%;"><h3>ICD Analysis</h3>High-frequency materials may create electrical connections and later long-term reliability and quality risks from inter-layer dielectric (ICD) issues. The root cause of ICD difficulties should be identified, and remedies developed to eliminate them in high-frequency material backplane PCB production. The main causes of ICD difficulties are resin gel residue on inner copper layers and poor cleaning techniques.Tips:<ul><li style="text-align: left;">Verify the degree of aging of board materials to avoid bonding inner copper layers with insufficiently aged resin.</li><li style="text-align: left;">Optimized drilling parameter controls for proper gel removal.</li></ul><h3>Backdrilling Stub</h3>At high speed, stubs would lead to distortions or even a total failure in transmission, which should be taken account. According to the studies, if the stub length is smaller than 0.25 mm, its effect on the signal is minimal and can thus be ignored. So, the length should be limited to the greatest outcomes.Tips:<ul><li style="text-align: left;">To ensure less deterioration of signal transmission quality, stub lengths should be consistent and remain below 0.25 mm.</li></ul>

Backplane PCBs support functional boards, distribute power, and transmit signals. Increased IC complexity demands more layers and high performance, creating challenges in alignment, drilling, electroplating, ICD issues, and stub management. Tips include precise alignment control, advanced drilling and plating techniques, and maintaining stub lengths below 0.25mm for optimal signal quality.

Key Difficulties and Tips for Backplane PCB Fabrication

The Production Process for Conformal Coating

The production process for conformal coating goes through eight steps. Each step is related to how effective, reliable, and efficient the coating will be on a printed circuit board (PCB).<h3 style="text-align: left;">1. Cleaning</h3>Cleaning is the initial stage of the procedure that gets rid of residues from operator handling, soldering, machine strain, and environmental contamination. Among the cleaning methods are:Aqueous Chemistries: This method cleans the board using water-based solutions.Solvent Cleaning: This method uses solvent-based chemicals for contaminant removal.Plasma Cleaning: Effective cleaning of the board surface is done using ionized gas.Validation tests for cleanliness are equally important, and these include:Ionic Contamination TestingIon ChromatographySurface Insulation Resistance<h3 style="text-align: left;">2. Priming</h3>The primer application involves the application of a preparatory coating over the board, enhancing adhesion and forming a binding layer for the applied conformal coating. The need for priming is variable and dependent upon the type of resin used:Acrylic and Polyurethane: These coatings are wet and generally adhere satisfactorily to most substrates without the use of a primer.Silicone Conformal Coating: This coating usually needs primers to promote a successful coating operation.Parylene Coatings: Priming involves either the gas phase or liquid processes.<h3 style="text-align: left;">3. Masking</h3>Masking is used to protect particular board components and areas from being coated. Of course, this is required since the coating functions as an insulator. Some typical masking materials are:Masking Tapes, Dots, and ShapesLiquid LatexMasking BootsThe type of masking material one chooses depends on the application and must be selected to ensure masking does not fail.<h3 style="text-align: left;">4. Application</h3>Conformal coating can be applied by brushing, spraying, dipping, and vapor deposition. All these methods are chosen based on the requirements of the coating and the board.<img src="https://img.pcbx.com/dev/file/image/article/20240729/223f57b3fa884415b0d9bb8a5329bb24.jpg" alt="PCB Conformal Coating-PCBX" data-href="" style="width: 100%;"><h3 style="text-align: left;">5. De-masking and Finishing</h3>After application, the masking materials are removed. The finishing processes ensure the following:Quality of CoatingPrevention of Masking LeakageVerification of StandardsPrevention of Coating DefectsThe identified defects are repaired before proceeding to the next step.<h3 style="text-align: left;">6. Drying and Curing</h3>It is important to understand that drying is not the same as curing. The difference is as follows:Drying: The time it takes for the PCB to become safe for operator handling, which might range from a few minutes to many days.Curing: This step ensures the coating attains its preferred electrical and mechanical properties to protect the board during operation.These are the cure mechanisms developed to effect the cure, such as:Heat CureMoisture CureUV CureCatalytic Cure<h3 style="text-align: left;">7. Inspection</h3>The most critical step in inspection is to ensure coating quality against the standards. This consists of:Manual InspectionUV Lamp VisibilityAutomated Optical Inspection (AOI)<h3 style="text-align: left;">8. Conformal Coating Chemistries</h3>Available chemistries are based on requirements, which include:Acrylic (Organic Liquid): &nbsp;Easy rework &nbsp;Easy drying &nbsp;Good moisture resistance &nbsp;Easy viscosity adjustmentPolyurethane (Organic Liquid): &nbsp;Dielectric Properties &nbsp;Abrasion resistance &nbsp;Solvent resistance &nbsp;Good moisture resistanceEpoxy (Organic Liquid): &nbsp;Good dielectric properties &nbsp;Higher Tg, glass transition temperature &nbsp;Effective at 150℃ &nbsp;Good abrasion resistanceSilicone (Inorganic Liquid): &nbsp;Stable over a wide temperature range &nbsp;High Tg &nbsp;Resistance to solvents &nbsp;Good dielectric strength

The conformal coating process for PCBs involves eight steps: Cleaning, Priming, Masking, Application, De-masking and Finishing, Drying and Curing, Inspection, and choosing Coating Chemistries, ensuring optimal coating performance.

Which Surface Finish is Right for Your PCBs?

The trend towards lead-free PCB (Printed Circuit Board) came from the European Union directive called ROHS: the Restriction of Hazardous Substances, stating that any electronics would have to be obeyed by the ROHS direction placed upon them. This, in turn, led to the transition from lead-based processes to lead-free manufacturing of PCB.<img src="https://img.pcbx.com/dev/file/image/article/20240729/13904daa6aab481186b68dd0230cc013.jpg" alt="Which Surface Finish is Right for Your PCBs? - PCBX" data-href="" style="width: 100%;">Plated pins of components, PCB plated pads, and solder are important sources of lead in solder joints. To ensure that the lead content of the solder joint complies with ROHS regulations which request that mass fraction is less than 0.1%, the surface finishes for use in PCBs have to satisfy lead-free requirements. Many surface finishes have been developed to support lead-free fabrication, and the most popular of which are ENIG, ImAg, ImSn, and OSP.Since each type of surface finish has different advantages and disadvantages, it is quintessential that you choose which one will best work for your projects. This article compares the four surface finishes based on application conditions, cost, lead-free compatibility, shelf life, solderability, etc to help pick out the best surface finish for your lead-free PCBs.<h2>ENIG</h2>ENIG is the abbreviation for Electroless Nickel/Immersion Gold, and its structures are as follows.<img src="https://img.pcbx.com/dev/file/image/article/20240729/7a3b86ab856b4d2ca13de030c05962de.PNG" alt="ENIG - PCBX" data-href="" style="width: 100%;"><ul><li style="text-align: left;">Overview</li></ul>As one of the lead-free surface finishes, the advantages of ENIG are featured with long storage life, good solderability, and flat surface. However, its main disadvantages include that it is comparatively expensive and has the risk of a "black pad."<ul><li style="text-align: left;">Black Pad</li></ul>A black pad is a defect in solder joints with ENIG applied, which results from serious erosion of the nickel layer. It's called "black pad" as the colors of a damaged nickel layer are grey and black.The primary drawback of the black pad is that it can't be easily eliminated, and it also cannot be detected by the naked eye, which creates a severe reliability threat to products.<ul><li style="text-align: left;">Disadvantages</li></ul>a. Non-wettabilityNon-wettability is the direct cause of black pad. Generally, a PCB with ENIG that suffers from a black pad cannot stand stress very well. Therefore, products experience fractures in solder joints under high-low temperature cycle tests, vibration tests, and plugging and unplugging every day, thus reducing reliability.b. Erosion TendencyThe erosion of the solder joints with ENIG may happen under humid conditions due to the thin thickness of the gold layer, which may have pinholes. While gold itself doesn't erode, the layer of nickel underneath is prone to erosion, thus affecting the solder joints.• Summary<img src="https://img.pcbx.com/dev/file/image/article/20240801/019d4fbb48694de880a7ea11796890dc.png" alt="ENIG Summary - pcbx" data-href="" style="width: 100%;"><h2>Im-Sn(Immersion Tin)</h2>Im-Sn means immersion tin. The surface finish is formed using a displacement reaction, and the layer is pure tin. Because of this, the thickness of the surface finish is normally limited to 1μm.<ul><li style="text-align: left;">Disadvantages</li></ul>a. Not Resistant to StorageThe tin layer could diffuse into the copper substrate even at normal temperatures. The tin can hold about 30 days at room temperature, and its diffusion rate is between 0.144 and 0.166 nm/s, however, its thickness would reduce approximately 0.23μm when converting to IMC. After reflow soldering, the thickness can reduce further by more than 0.8μm. If storage for 180 days is required, the soldering has to be done three times such that the Im-Sn minimum thickness is above 1.28μm. However, this is often not achievable by the common thicknesses whose values are around 1.15μm.b. Color ChangeDue to the increase in temperature during soldering, the Im-Sn layer would lead to color change, the reason why is by the organic contaminants or the tin oxidation. In general, the thickness of the tin oxide layer is determined by the darkness of the color.c. Ineffective for Fine-Pitch AssemblyThe tin plating chemical solution adversely impacts most solder masks; hence, Im-Sn cannot be recommended for use in the fine-pitch assembly. The implications are equal to black pad in ENIG. Im-Sn interactions are prone to tin whiskers, while pad spacing exceeding 0.4 mm would avoid this happening.Via-filled inks may cause topographical damage through the dry film application, which leads to fractures that trap a portion of the chemical solution. Any expelled solution during reflow soldering greatly would impact the final product's appearance and reliability.• Summary<img src="https://img.pcbx.com/dev/file/image/article/20240801/00a46268690d4799b1e7382cbb997cf5.png" alt="Im-Sn(Immersion Tin) Summary - PCBX" data-href="" style="width: 100%;"><h2>Im-Ag</h2>Im-Ag is the abbreviation for immersion silver. It is a process in which a layer of silver is deposited on a surface through a chemical solution. The layer is not pure silver, consisting of an organic part, with mass fraction of about 30%.<ul><li style="text-align: left;">Disadvantages</li></ul>a. Micro CavitiesThere are microcavities with a diameter of less than 0.05 mm on the surface of silver, resulting in solder joints having intense damage, further enhanced when the PCB is subjected to mechanical shocks, which may cause defects in the products.Creeping corrosion is one of the major defects of Im-Ag, which may happen due to galvanic coupling between exposed copper at the edge of the solder mask and the higher surface silver area, eventually corroding in a humid environment.b. Silver MigrationThis is another typical kind of defect that occurs in thick-film circuits or inside the IC.c. Color ChangeAn immersion silver layer on the surface of a board will change color to yellow or black after exposure to air, basically because tiny holes on the surface of the silver react with the halogens in the atmosphere, and the surface color can also be different after soldering. Two factors contribute to this color change after soldering: plating thickness and exposure time. Earlier studies have shown that an increase in thickness used during plating also improves resistance to discoloration or helps preserve the color of the surface in applications with short exposure time.• Summary<img src="https://img.pcbx.com/dev/file/image/article/20240801/c9d74aae0f9649889b5bf73e997656b9.png" alt="Im-Ag Summary - pcbx" data-href="" style="width: 100%;"><h2>OSP(Organic Solderability Preservatives)</h2>Organic Solderability Preservatives are sets of organic film layers created on clean copper through chemical means, which protects copper essentially from oxidation and prevents thermal shock, improving solderability.<ul><li style="text-align: left;">Problems Encountered by OSP After Soldering</li></ul>Problem #1: Volatilization/ Mass LossUnder high temperatures in a reflow soldering oven, OSP has little volatilization with a mass loss of not less than 10%. This serves to mean that the thinnest possible layer shall be used for the OSP application.Challenge #2: Heat StabilityOSP does not decompose up to 260°C, but sublimes, meaning that it could passe directly from the solid into the gaseous state without releasing any heat.Challenge #3:Reaction with OxygenOSP tends to oxidize in the soldering process.Challenge #4: Discoloration and DeteriorationWhen OSP is exposed to a soldering oven, it can quickly turn in color to rust, negatively impacting its solderability.Challenge #5: Difficulties in RemovalOSP may ultimately turn out to be challenging to remove when the flux is applied to it, so stronger flux agents are required to its effective removal.• Summary<img src="https://img.pcbx.com/dev/file/image/article/20240801/70462b74446a45f4b69fd39e77552f13.png" alt="OSP(Organic Solderability Preservatives) Summary - pcbx" data-href="" style="width: 100%;">&lt;button class="center btn-lg" data-href="/order/manufacturing/pcb"&gt;Request a Custom PCB Quote Online&lt;/button&gt;<h2>PCBX Ready to Help You with Online PCB Solutions </h2>PCBX is always ready to provide online help regarding your PCB needs. With the comprehensive one-stop solution for PCB fabrication, PCB assembly, and component sourcing, PCBX serves customers with high-quality products at competitive prices, clicking the button below to get the best PCBs for your projects.

The trend towards lead-free PCB manufacturing comes due to the EU's ROHS directive, which requires compliance to the limits on the content of lead. Compliance with lead-free is achieved by different surface finishes such as ENIG, ImAg, ImSn, and OSP—all with their different pros and cons. This paper compares these finishes to help choose the best for specific PCB applications.